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SN54LS297J

Texas Instruments

SN54LS297J by Texas Instruments

SN54LS297J by Texas Instruments is a TTL logic IC with 16 terminals, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and is ideal for military-grade applications requiring reliable performance in harsh environments. The package material is ceramic, metal-sealed cofired, making it durable for various industrial uses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,816 parts In-Stock

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3,816

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Digiode

USA . 1,610 parts In-Stock

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1,610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$4.977

100+ parts

-

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198

$4.977

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One Stop Electronics

USA . 728 parts In-Stock

1+ parts

$15.000

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728

$15.000

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Parana Technologies

USA . 2,096 parts In-Stock

1+ parts

$19.701

100+ parts

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$19.690

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2,096

$19.701

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$19.690

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DigiPath Technology Company

USA . 1,542 parts In-Stock

1+ parts

$21.693

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1,542

$21.693

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ChromeModa Solutions

Germany . 4,903 parts In-Stock

1+ parts

$22.136

100+ parts

$18.152

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4,903

$22.136

$18.152

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IDEA Electronic Components Group

UK . 1,960 parts In-Stock

1+ parts

$22.136

100+ parts

$21.029

1k+ parts

$19.922

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1,960

$22.136

$21.029

$19.922

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Corphita

USA . 3,737 parts In-Stock

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3,737

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Overview

Enhance your electronic designs with the Texas Instruments SN54LS297J, a high-quality Other Function Logic IC perfect for military-grade applications. With a ceramic, metal-sealed co-fired package and TTL technology, this IC offers reliable performance in extreme temperatures ranging from -55°C to 125°C. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing and discover the value and benefits this versatile IC brings to your projects. Elevate your designs with the SN54LS297J today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and heat resistance, making this product suitable for harsh operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic circuit boards.

Nominal Supply Voltage: 5V

The 5V supply voltage provides compatibility with a wide range of electronic systems and circuits.

No. of Terminals: 16

The high number of terminals allows for versatile connectivity options and flexibility in circuit design.

Package Style: IN-LINE

The in-line package style saves space and facilitates neat arrangement of components on a circuit board.

Maximum Operating Temperature: 125°C

The high maximum operating temperature ensures reliable performance even in environments with elevated heat levels.

Minimum Operating Temperature: -55°C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Technology: TTL

The use of TTL technology ensures fast switching speeds and low power consumption, making this product suitable for high-speed applications.

Technical Specifications

Other Function Logic ICs SN54LS297J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN54LS297J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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