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SN54AS8840GB

Texas Instruments

SN54AS8840GB by Texas Instruments

Texas Instruments SN54AS8840GB is a TTL logic IC with 156 pins, operating at -55 to 125°C. It has a square ceramic package and requires a 5V power supply. Ideal for military-grade applications due to its MIL temperature grade and grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,706 parts In-Stock

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3,706

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Digiode

USA . 497 parts In-Stock

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497

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Distributors (Availability)

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AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$9.557

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735

$9.557

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Parana Technologies

USA . 1,695 parts In-Stock

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$21.620

100+ parts

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$22.026

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1,695

$21.620

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$22.026

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DigiPath Technology Company

USA . 916 parts In-Stock

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$23.806

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916

$23.806

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ChromeModa Solutions

Germany . 3,118 parts In-Stock

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$24.292

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$19.919

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3,118

$24.292

$19.919

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IDEA Electronic Components Group

UK . 950 parts In-Stock

1+ parts

$24.292

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$23.077

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$21.863

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950

$24.292

$23.077

$21.863

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One Stop Electronics

USA . 1,028 parts In-Stock

1+ parts

$54.000

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1,028

$54.000

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Corphita

USA . 221 parts In-Stock

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221

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Overview

Discover the innovative SN54AS8840GB by Texas Instruments, a high-quality Other Function Logic IC that offers unparalleled performance and reliability. With a MILITARY-grade temperature range and a durable CERAMIC package, this TTL technology IC is ideal for a wide range of applications. From military and aerospace to industrial automation, this versatile IC delivers exceptional value and benefits to customers seeking robust functionality and long-term reliability. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and durability, making the product suitable for high temperature and harsh environments.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a commonly used voltage level in many electronic systems, ensuring compatibility and ease of integration.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can handle high temperature conditions without compromising performance.

Technology: TTL

Using TTL technology ensures high speed and reliable operation, making it a great choice for applications requiring fast response times.

Technical Specifications

Other Function Logic ICs SN54AS8840GB attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P156

No. of Terminals:

156

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA156M,15X15MOD

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SN54AS8840GB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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