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NLX1G98BMX1TCG

Onsemi

NLX1G98BMX1TCG by Onsemi

NLX1G98BMX1TCG by Onsemi is a CMOS Schmitt Trigger IC with 6.3ns propagation delay, 50pF load capacitance, and 24A max I (ol). Ideal for military applications due to its MIL-graded temperature range and small outline package style.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 999 parts In-Stock

1+ parts

$1.190

100+ parts

$0.381

1k+ parts

$0.309

10k+ parts

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999

$1.190

$0.381

$0.309

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Rochester

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

48,000

-

$0.092

$0.077

$0.068

DigiKey

USA . 48,000 parts In-Stock

1+ parts

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$0.080

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$0.080

Verical

USA . 48,000 parts In-Stock

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$0.086

48,000

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$0.086

Distributors (In-Stock)

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Digiode

USA . 146 parts In-Stock

1+ parts

$0.072

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$0.072

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Vyrian

USA . 1,713 parts In-Stock

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$0.076

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1,713

$0.076

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Distributors (Availability)

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Corphita

USA . 389 parts In-Stock

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$0.068

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389

$0.068

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Vigor

Singapore . 344 parts In-Stock

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$0.070

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344

$0.070

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Corohmni

South Africa . 92 parts In-Stock

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$0.076

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92

$0.076

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Continental Prestige Electronics

USA . 48,000 parts In-Stock

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$0.066

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$0.066

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QUARKTWIN TECHNOLOGY LTD

USA . 28,082 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 5,087 parts In-Stock

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SupplyDigital Components

Austria . 3,227 parts In-Stock

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TANS Electronics

Latvia . 2,301 parts In-Stock

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Kulean Microsystems

USA . 2,247 parts In-Stock

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GreenTree Electronics

Israel . 999 parts In-Stock

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UHIMA Technologies

Türkiye . 837 parts In-Stock

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837

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Microchip USA

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Overview

Enhance your electronic projects with the high-quality NLX1G98BMX1TCG by Onsemi. Designed with precision and reliability in mind, this Other Function Logic IC boasts a fast propagation delay of just 6.3 ns, making it ideal for applications requiring quick response times. Whether you're working on a DIY project or a professional application, this surface mount component offers unmatched performance and efficiency. Trust Onsemi's reputation for excellence and innovation, and experience the value and benefits this product brings to your designs. Step up your electronics game with the NLX1G98BMX1TCG today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast response times, making this product suitable for applications requiring quick signal processing.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 2.3

Low nominal supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages.

Technical Specifications

Other Function Logic ICs NLX1G98BMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G98BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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