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SN74LVC1G98DBVTE4

Texas Instruments

SN74LVC1G98DBVTE4 by Texas Instruments

SN74LVC1G98DBVTE4 by Texas Instruments is a CMOS logic IC with 6.3ns propagation delay, 50pF load capacitance, and 24A max I (ol). It is used in industrial applications for its Schmitt Trigger feature and operates at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,767 parts In-Stock

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Digiode

USA . 2,424 parts In-Stock

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AZTECH Wire

Italy . 527 parts In-Stock

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$16.630

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Parana Technologies

USA . 2,103 parts In-Stock

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$22.377

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$23.052

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ChromeModa Solutions

Germany . 3,098 parts In-Stock

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$25.143

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$20.617

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

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$25.143

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$23.886

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$22.629

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One Stop Electronics

USA . 1,533 parts In-Stock

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$65.000

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DigiPath Technology Company

USA . 553 parts In-Stock

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Corphita

USA . 542 parts In-Stock

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Overview

Discover the SN74LVC1G98DBVTE4 by Texas Instruments, a high-quality Other Function Logic IC that offers unmatched performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is perfect for a variety of applications. Experience the value and benefits of this versatile IC, from its 3-STATE output characteristics to its Schmitt Trigger technology. Whether you need a compact solution for industrial-grade projects or a reliable component for your electronic designs, the SN74LVC1G98DBVTE4 delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and resistance to heat and chemicals, making it a reliable choice for electronic components.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement makes this product energy-efficient and compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

This product can drive a load capacitance of 50 pF, which is suitable for driving capacitive loads in electronic circuits.

Power Supplies (V): 3.3

Operates on a standard 3.3V power supply, ensuring compatibility with common power sources.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and potential for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style with low profile and shrink pitch saves space and allows for efficient placement on circuit boards.

Maximum I (ol): 24 Amp

High output current capability of 24 Amps enables this product to drive heavy loads without the need for additional amplification.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures in industrial environments.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal, providing additional functionality in digital logic circuits.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures as low as -40°C, making it suitable for a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and ease of connection in different circuit configurations.

Maximum Seated Height: 1.45 mm

Low seated height of 1.45 mm saves space and allows for compact design in electronic systems.

Width: 1.6 mm

Narrow width of 1.6 mm enables dense packing of components on circuit boards, maximizing space efficiency.

Minimum Supply Voltage (Vsup): 1.65 V

This product can operate at a minimum supply voltage of 1.65V, allowing for flexibility in power supply requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperature of 260°C during soldering process, demonstrating robust construction.

Length: 2.9 mm

Compact length of 2.9 mm allows for space-saving design in electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Schmitt Trigger: YES

Includes Schmitt trigger functionality for noise immunity and signal conditioning, enhancing the reliability of digital logic operations.

Technology: CMOS

Utilizes CMOS technology known for its low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering, ensuring secure connections in electronic circuits.

Packing Method: TR

TR packing method offers convenient tape and reel packaging for automated assembly, improving efficiency in manufacturing processes.

Terminal Pitch: 0.95 mm

Narrow terminal pitch of 0.95 mm allows for high-density mounting on circuit boards, maximizing functionality in limited space.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage levels and is compatible with a wide range of power sources.

Technical Specifications

Other Function Logic ICs SN74LVC1G98DBVTE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G98DBVTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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