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NBSG86AMAHTBG

Onsemi

NBSG86AMAHTBG by Onsemi

NBSG86AMAHTBG by Onsemi is a 16-terminal logic IC with a nominal voltage of 2.5V, operating b/w -40 to 70 °C. Its square package style is surface mountable and has a thin profile, making it suitable for applications requiring precise signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,428 parts In-Stock

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Digiode

USA . 1,591 parts In-Stock

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1,591

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SupplyDigital Components

Austria . 7,849 parts In-Stock

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Problanco Electronics

Mexico . 5,514 parts In-Stock

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Corphita

USA . 2,468 parts In-Stock

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TANS Electronics

Latvia . 1,413 parts In-Stock

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Kulean Microsystems

USA . 1,403 parts In-Stock

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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721

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Corohmni

South Africa . 237 parts In-Stock

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Overview

Looking for a high-quality, reliable logic IC for your electronic projects? Look no further than the NBSG86AMAHTBG by Onsemi. With its surface mount design and grid array package style, this IC is perfect for a wide range of applications. From consumer electronics to industrial controls, this product offers exceptional value and performance. Trust Onsemi's reputation for excellence and choose the NBSG86AMAHTBG for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient placement on a PCB, saving space and making it suitable for compact designs.

Package Shape: SQUARE

The square package shape allows for uniform placement on the circuit board, optimizing the use of space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V offers a standard operating range that is compatible with many other components, ensuring stable performance.

No. of Terminals: 16

With 16 terminals, this logic IC provides a wide range of input and output options, suitable for complex logic operations.

Package Style (Meter): GRID ARRAY, THIN PROFILE

The grid array package style with thin profile offers high density integration and reduced height, ideal for applications with limited space.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures that the logic IC can withstand elevated thermal conditions, increasing reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the logic IC to operate in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and enables easy soldering, enhancing the overall ease of use and assembly.

Maximum Seated Height: 1.03 mm

The low maximum seated height of 1.03mm contributes to a slim and compact design, making it suitable for applications with height restrictions.

Width: 4 mm

The compact width of 4mm allows for efficient use of space on the PCB, enabling more components to be accommodated in a limited area.

Minimum Supply Voltage (Vsup): 2.375 V

The low minimum supply voltage of 2.375V ensures compatibility with a wide range of power sources, offering flexibility in design.

Length: 4 mm

The compact length of 4mm further contributes to space-saving design, making it suitable for applications where size is a critical factor.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and allows for easy soldering, ensuring secure and stable operation.

Terminal Pitch: 1 mm

The tight terminal pitch of 1mm allows for high-density mounting, enabling more components to be placed in a small area for efficient space utilization.

Maximum Supply Voltage (Vsup): 3.465 V

The high maximum supply voltage of 3.465V provides a wide operating range and can accommodate different power sources, ensuring versatility in applications.

Technical Specifications

Other Function Logic ICs NBSG86AMAHTBG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XBGA-B16

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.03 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

NBSG86AMAHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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