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74LVC1G57GF,132

NXP Semiconductors

74LVC1G57GF,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GF,132 is a CMOS logic IC with 7.9ns propagation delay at 1.8V supply voltage. It features Schmitt Trigger and operates in automotive temperature grade range (-40 to 125°C). This IC is ideal for applications requiring fast response times and low power consumption.

Median Price

$0.162

Lifecycle Status

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14

In-Stock Inventory

1k+

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Rochester

USA . 1,889,345 parts In-Stock

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$0.175

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$0.146

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$0.130

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$0.175

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$0.130

DigiKey

USA . 1,889,345 parts In-Stock

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$0.220

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Verical

USA . 125,000 parts In-Stock

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$0.162

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$0.162

Arrow

USA . 475 parts In-Stock

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$0.072

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475

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$0.072

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Chip1Stop

Japan . 475 parts In-Stock

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$0.090

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475

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$0.090

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Digiode

USA . 2,338 parts In-Stock

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$0.070

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DigiKey Marketplace

USA . 1,889,345 parts In-Stock

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$0.080

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Chip Stock

USA . 95,000 parts In-Stock

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VNN

France . 15,639 parts In-Stock

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Connect4Technologies Inc.

Canada . 9,185 parts In-Stock

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Vyrian

USA . 4,584 parts In-Stock

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Anansix

USA . 2,741 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Semicontronic

India . 1,090,512 parts In-Stock

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$0.062

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$0.060

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$0.060

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Corphita

USA . 1,483 parts In-Stock

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$0.067

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Component Stockers USA

USA . 2,029,150 parts In-Stock

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$0.080

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$0.070

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$0.060

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$0.060

2,029,150

$0.080

$0.070

$0.060

$0.060

AZTECH Wire

Italy . 8,395 parts In-Stock

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$0.090

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Ampacity Inc.

Singapore . 1,090,752 parts In-Stock

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$0.135

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Microchip USA

USA . 1,702 parts In-Stock

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Corohmni

South Africa . 239 parts In-Stock

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$19.987

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Aztec Data Supply Inc.

USA . 2,171 parts In-Stock

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Argo Parts USA

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Supply Digital

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Continental Prestige Electronics

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UNI Independent Distributors

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Bastille Electronics

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Overview

Unleash the power of innovation with the 74LVC1G57GF,132 from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability in their products. This versatile Other Function Logic IC is perfect for a variety of applications, offering customers unmatched value and performance. With a fast propagation delay, low power consumption, and a wide range of operating temperatures, this IC is the ideal choice for your next project. Elevate your designs with NXP Semiconductors and experience the difference today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides a durable and reliable housing for the IC, making it suitable for a wide range of applications.

Propagation Delay at Nominal Supply:

7.9 ns - The low propagation delay ensures fast signal processing and enhances the overall performance of the IC.

Surface Mount:

YES - This allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape:

SQUARE - The square shape makes the IC compact and space-efficient, ideal for designs with limited space constraints.

Nominal Supply Voltage (Vsup):

1.8 V - The low supply voltage helps in reducing power consumption and optimizing energy efficiency.

Load Capacitance (CL):

50 pF - The moderate load capacitance ensures stable and reliable operation in various circuit configurations.

Power Supplies (V):

3.3 - The multiple power supplies provide flexibility in voltage requirements, making it versatile for different applications.

No. of Terminals:

6 - The sufficient number of terminals allows for easy connection and integration into the circuit.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE - The compact and thin profile package design saves space and is ideal for compact electronic devices.

Maximum I (ol):

24 Amp - The high output current capability allows for driving of external loads without the need for additional buffer circuits.

Maximum Operating Temperature:

125 °C - The high operating temperature range ensures reliability and stability in harsh environmental conditions.

Minimum Operating Temperature:

40 °C - The wide temperature range makes the IC suitable for use in both hot and cold environments.

Terminal Finish:

Tin (Sn) - The tin finish provides good solderability and ensures a secure connection during assembly.

Terminal Position:

DUAL - The dual terminal position offers flexibility in PCB layout and design, allowing for easy routing of signals.

Maximum Seated Height:

0.5 mm - The low profile design minimizes the overall height of the IC, making it suitable for slim and compact electronic devices.

Width:

1 mm - The narrow width of the IC allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup):

1.65 V - The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature:

30 s - The maximum time at peak reflow temperature ensures reliable soldering and assembly during manufacturing.

Peak Reflow Temperature:

260 °C - The high peak reflow temperature tolerance ensures strong solder joints and reliability in the assembly process.

Length:

1 mm - The compact length of the IC minimizes the footprint on the PCB, enabling denser designs.

Temperature Grade:

AUTOMOTIVE - The automotive-grade temperature rating ensures reliability and performance in automotive applications.

Schmitt Trigger:

YES - The Schmitt trigger feature helps in achieving clean and stable digital signal processing, reducing noise and errors in the circuit.

Technology:

CMOS - The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the IC efficient and reliable.

Terminal Form:

NO LEAD - The lead-free terminal form complies with environmental regulations and ensures compatibility with lead-free soldering processes.

Packing Method:

TR - The tape and reel packing method enhances convenience and efficiency in handling and storage of the IC.

Terminal Pitch:

0.35 mm - The small terminal pitch enables high-density mounting and allows for compact designs with minimal spacing between terminals.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Other Function Logic ICs 74LVC1G57GF,132 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G57GF,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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