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SNJ54LS629J

Texas Instruments

SNJ54LS629J by Texas Instruments

SNJ54LS629J by Texas Instruments is a TTL logic IC with 2 functions, 15ns propagation delay, and 5V nominal voltage. It is used in military-grade applications, featuring MIL-PRF-38535 screening level and operating temperature range of -55 to 125°C. The package style is in-line with ceramic body material and through-hole terminal form.

Median Price

$35.595

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 211 parts In-Stock

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-

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$31.640

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$28.310

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$26.650

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$26.650

DigiKey

USA . 211 parts In-Stock

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Verical

USA . 75 parts In-Stock

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$39.550

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$35.388

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$33.313

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$35.388

$33.313

Distributors (In-Stock)

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Freelance Electronics

USA . 61 parts In-Stock

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$17.922

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$18.818

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$17.742

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Bristol Electronics

USA . 220 parts In-Stock

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$26.519

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$23.459

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$21.746

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Digiode

USA . 3,200 parts In-Stock

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$30.372

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Vyrian

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DigiKey Marketplace

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Microfarads

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Manoshevitz Elec. Sales

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QIE Inc.

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Quantum Digital Technology

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First Choice Components Inc.

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Resion

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Electronics Depot

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North Shore Components

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MISTER SPROCKETS

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Electronic Expediters

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Holdelec - ElecDif-Pro

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Digital Electronic Gebert Verwaltungs UG

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Inland Empire Components Inc.

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Mil-Aero Solutions, Inc.

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GSS - Global Semi Support

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.083

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$15.546

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$14.008

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Parana Technologies

USA . 2,272 parts In-Stock

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$28.522

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$48.490

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Corphita

USA . 4,232 parts In-Stock

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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ChromeModa Solutions

Germany . 3,796 parts In-Stock

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$26.279

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IDEA Electronic Components Group

UK . 715 parts In-Stock

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$32.047

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$30.445

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$28.842

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Microchip USA

USA . 2,192 parts In-Stock

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Perfect Parts

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Assy Fe

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Overview

Unlock the power of cutting-edge technology with the SNJ54LS629J by Texas Instruments. Crafted with precision and expertise, this high-quality logic IC offers unbeatable performance and reliability. Ideal for a wide range of applications, this product boasts fast propagation delay and low power consumption, making it a valuable asset for any project. Trust Texas Instruments to deliver excellence in every detail, providing you with the tools you need to succeed. Elevate your work with the SNJ54LS629J and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments.

Screening Level: MIL-PRF-38535

Meets military screening standards for reliability and performance, ensuring quality.

Technology: TTL

Uses Transistor-Transistor Logic technology known for its high speed and compatibility with various systems.

Technical Specifications

Other Function Logic ICs SNJ54LS629J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54LS629J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-122-1918, 5962011221918

NIIN

011221918

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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