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74AUP1G97L6X

Onsemi

74AUP1G97L6X by Onsemi

74AUP1G97L6X by Onsemi is a CMOS logic IC with Schmitt Trigger feature. It operates at a supply voltage range of 0.8V to 3.6V and has a propagation delay of 19ns. This small outline package with dual terminals is ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.183

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 414,691 parts In-Stock

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Rochester

USA . 138,398 parts In-Stock

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$0.183

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$0.152

10k+ parts

$0.135

138,398

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$0.183

$0.152

$0.135

Verical

USA . 100,000 parts In-Stock

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$0.169

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$0.169

DigiKey

USA . 26,158 parts In-Stock

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$0.230

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$0.230

Distributors (In-Stock)

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Digiode

USA . 2,187 parts In-Stock

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$0.142

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Vyrian

USA . 2,550 parts In-Stock

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$0.150

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Flip Electronics

USA . 389,691 parts In-Stock

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DigiKey Marketplace

USA . 295,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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ComSIT USA

USA . 5,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,397 parts In-Stock

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Bristol Electronics

USA . 2,397 parts In-Stock

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$0.370

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$0.182

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$0.160

2,397

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$0.160

Dan-Mar Components

USA . 2,397 parts In-Stock

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Corphita

USA . 3,096 parts In-Stock

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$0.135

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Corohmni

South Africa . 479 parts In-Stock

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$0.150

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479

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QUARKTWIN TECHNOLOGY LTD

USA . 19,951 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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Microchip USA

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Problanco Electronics

Mexico . 5,364 parts In-Stock

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TANS Electronics

Latvia . 2,453 parts In-Stock

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Supply Digital

USA . 2,057 parts In-Stock

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UHIMA Technologies

Türkiye . 978 parts In-Stock

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SupplyDigital Components

Austria . 690 parts In-Stock

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Northwest PG Solutions

USA . 657 parts In-Stock

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Native Components

USA . 48 parts In-Stock

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$3.663

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48

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$3.663

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Overview

Unleash the power of innovation with the 74AUP1G97L6X by Onsemi. As a leader in quality electronics, Onsemi brings you a cutting-edge Other Function Logic IC that promises reliability and performance. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience the seamless integration and superior functionality that this product provides. Elevate your projects to new heights with the 74AUP1G97L6X by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 19 ns

Fast propagation delay allows for quick response times in logic operations, making this product efficient.

Surface Mount: YES

Easy to install and saves space on the PCB, making integration into electronic devices simpler.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low voltage, reducing power consumption and improving efficiency.

Load Capacitance (CL): 30 pF

Designed to work effectively with a specific load capacitance, ensuring optimal performance.

No. of Terminals: 6

Provides necessary connections for input and output signals, allowing for versatile use in different applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments, increasing its usability in various conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating environments.

Technology: CMOS

Utilizes CMOS technology, which is known for low power consumption and high noise immunity, contributing to energy efficiency and reliability.

Technical Specifications

Other Function Logic ICs 74AUP1G97L6X attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1G97L6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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