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SN74LS448DW3

Texas Instruments

SN74LS448DW3 by Texas Instruments

SN74LS448DW3 by Texas Instruments is a TTL technology logic IC with 20 terminals in a small outline package. It operates at temperatures b/w 0°C to 70°C, with a nominal voltage of 5V. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,142 parts In-Stock

1+ parts

-

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1k+ parts

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5,142

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Digiode

USA . 1,262 parts In-Stock

1+ parts

-

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-

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1,262

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$8.623

100+ parts

-

1k+ parts

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10k+ parts

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257

$8.623

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Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

$14.671

100+ parts

-

1k+ parts

$15.112

10k+ parts

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2,332

$14.671

-

$15.112

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DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$16.154

100+ parts

-

1k+ parts

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698

$16.154

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ChromeModa Solutions

Germany . 2,725 parts In-Stock

1+ parts

$16.484

100+ parts

$13.517

1k+ parts

-

10k+ parts

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2,725

$16.484

$13.517

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IDEA Electronic Components Group

UK . 503 parts In-Stock

1+ parts

$16.484

100+ parts

$15.660

1k+ parts

$14.836

10k+ parts

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503

$16.484

$15.660

$14.836

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One Stop Electronics

USA . 682 parts In-Stock

1+ parts

$39.000

100+ parts

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10k+ parts

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682

$39.000

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Corphita

USA . 4,800 parts In-Stock

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4,800

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Overview

Upgrade your electronics projects with the high-quality SN74LS448DW3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability. This versatile Other Function Logic IC is perfect for a wide range of applications. With its compact size and innovative technology, it provides value and benefits that will take your designs to the next level. Trust Texas Instruments to deliver exceptional products that exceed expectations. Make the smart choice and choose the SN74LS448DW3 for all your logic IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the IC, making it reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts and allows for easy integration into various electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with a wide range of electronic systems, offering flexibility in design and implementation.

Technology: TTL

Using TTL technology ensures fast and reliable logic operations, making the IC suitable for applications requiring high-speed data processing.

Technical Specifications

Other Function Logic ICs SN74LS448DW3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS448DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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