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74AUP1T97L6X

Onsemi

74AUP1T97L6X by Onsemi

74AUP1T97L6X by Onsemi is a CMOS Schmitt Trigger IC with 8.9ns propagation delay, operating at -40 to 85°C. It has a load capacitance of 30pF, suitable for industrial applications requiring fast response times and low power consumption. This small outline IC with dual terminals is ideal for surface mount designs in compact electronic devices.

Median Price

$0.229

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 90,000 parts In-Stock

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$0.220

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$0.220

Rochester

USA . 90,000 parts In-Stock

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$0.238

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$0.197

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$0.176

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$0.197

$0.176

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Nova Conductors

Japan . 500 parts In-Stock

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$0.326

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$0.326

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Flip Electronics

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Martec Srl

Italy . 20,000 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Digiode

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Vyrian

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VNN

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iBuyXS LLC

. 20,000 parts In-Stock

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$0.290

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$0.290

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Continental Prestige Electronics

USA . 4,079 parts In-Stock

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$0.326

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$0.319

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$0.326

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Netroflash

USA . 2,000 parts In-Stock

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$0.326

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$0.326

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Argo Parts USA

USA . 1,710 parts In-Stock

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$0.326

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$0.316

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$0.326

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$0.316

AZTECH Wire

Italy . 421 parts In-Stock

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$7.622

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Ampacity Inc.

Singapore . 1,549 parts In-Stock

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$9.000

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Aztec Data Supply Inc.

USA . 1,548 parts In-Stock

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$19.448

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Semicontronic

India . 1,020 parts In-Stock

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$24.375

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BidChips

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Perfect Parts

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Problanco Electronics

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TANS Electronics

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SupplyDigital Components

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Microchip USA

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UHIMA Technologies

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Kulean Microsystems

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Corohmni

South Africa . 358 parts In-Stock

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Overview

Upgrade your electronic devices with the 74AUP1T97L6X by Onsemi, a top-quality Other Function Logic IC that offers unmatched performance and reliability. Designed with advanced CMOS technology, this IC is perfect for industrial applications where precision and efficiency are crucial. With a fast propagation delay of just 8.9 ns, low power consumption, and wide operating temperature range, this compact and durable IC provides exceptional value and functionality to meet all your design needs. Trust Onsemi for cutting-edge technology and superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 8.9 ns

The low propagation delay ensures fast signal processing, making this product efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 2.5

The stable supply voltage of 2.5V ensures consistent performance and compatibility with a range of systems.

Load Capacitance (CL): 30 pF

With a low load capacitance, this product can drive capacitive loads efficiently without compromising signal integrity.

Power Supplies (V): 2.5/3.3

This product can operate on multiple power supply voltages, offering flexibility in different voltage environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in demanding industrial environments.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Other Function Logic ICs 74AUP1T97L6X attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

3.1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

8.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1T97L6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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