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SNJ54LS626FK

Texas Instruments

SNJ54LS626FK by Texas Instruments

SNJ54LS626FK by Texas Instruments is a TTL logic IC with 2 functions, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a square chip carrier package suitable for military-grade applications. This surface-mount IC features a ceramic, metal-sealed cofired body and is ideal for various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,350 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,350

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Digiode

USA . 3,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$11.973

100+ parts

-

1k+ parts

-

10k+ parts

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727

$11.973

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-

-

Parana Technologies

USA . 618 parts In-Stock

1+ parts

$28.078

100+ parts

-

1k+ parts

$43.508

10k+ parts

-

618

$28.078

-

$43.508

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ChromeModa Solutions

Germany . 1,557 parts In-Stock

1+ parts

$31.548

100+ parts

$25.869

1k+ parts

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10k+ parts

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1,557

$31.548

$25.869

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IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$31.548

100+ parts

$29.971

1k+ parts

$28.393

10k+ parts

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427

$31.548

$29.971

$28.393

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One Stop Electronics

USA . 492 parts In-Stock

1+ parts

$41.000

100+ parts

-

1k+ parts

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10k+ parts

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492

$41.000

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Corphita

USA . 3,765 parts In-Stock

1+ parts

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3,765

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DigiPath Technology Company

USA . 747 parts In-Stock

1+ parts

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100+ parts

$28.444

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747

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$28.444

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Overview

Elevate your electronics projects with the top-of-the-line SNJ54LS626FK from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology with this Other Function Logic IC. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers looking for high-performance solutions. Trust in Texas Instruments for all your electronic needs and experience the difference with the SNJ54LS626FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and stability in various environmental conditions.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in a single logic IC increases efficiency and reduces the need for multiple components, leading to cost savings.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources and ensures stable performance.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the PCB, enhancing overall design aesthetics and manufacturability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this logic IC can withstand elevated temperatures, making it suitable for industrial applications.

Technology: TTL

Utilizing TTL technology enables faster switching speeds and lower power consumption, making it ideal for high-speed digital applications.

Technical Specifications

Other Function Logic ICs SNJ54LS626FK attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54LS626FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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