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5962-9204601MCX

Texas Instruments

5962-9204601MCX by Texas Instruments

5962-9204601MCX by Texas Instruments is a MIL-STD-883 compliant TTL IC with 14 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and comes in an in-line package style. Ideal for military-grade applications requiring true output polarity and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,631 parts In-Stock

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Digiode

USA . 4,186 parts In-Stock

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Native Components

USA . 912 parts In-Stock

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$0.924

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912

$0.924

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Northwest PG Solutions

USA . 391 parts In-Stock

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$1.016

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$1.016

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AZTECH Wire

Italy . 611 parts In-Stock

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$18.428

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Parana Technologies

USA . 1,187 parts In-Stock

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$23.468

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$24.100

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$23.468

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DigiPath Technology Company

USA . 1,173 parts In-Stock

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$25.842

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$23.774

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$25.842

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

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$26.369

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$25.051

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$23.732

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2,048

$26.369

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ChromeModa Solutions

Germany . 1,631 parts In-Stock

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$26.369

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$21.623

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One Stop Electronics

USA . 165 parts In-Stock

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$61.000

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Corphita

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Overview

Unlock the power of cutting-edge technology with the 5962-9204601MCX by Texas Instruments. Crafted with precision and expertise, this MIL-STD-883 screened Other Function Logic IC offers unparalleled performance and reliability in a compact package. Ideal for military-grade applications, this TTL technology-based IC ensures seamless operation even in extreme temperatures. Experience the advantage of true output polarity and dual terminal positions, all while enjoying the peace of mind that comes with Texas Instruments' reputation for excellence. Elevate your projects with the unmatched quality and value of the 5962-9204601MCX.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material provides excellent durability and protection for the internal components of the IC, ensuring long-term reliability.

Screening Level: MIL-STD-883

Compliance with this military standard ensures high-quality manufacturing processes and reliability, making it suitable for critical applications.

Nominal Supply Voltage / Vsup: 5V

The 5V supply voltage is a common standard in many electronic systems, making this IC compatible with a wide range of applications.

Maximum Operating Temperature: 125°C

The high maximum operating temperature allows this IC to function reliably in harsh environments or during extended operation.

Technology: TTL

TTL technology is known for its fast switching speeds and compatibility with various digital systems, making this IC suitable for high-speed applications.

Technical Specifications

Other Function Logic ICs 5962-9204601MCX attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

5962-9204601MCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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