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74LVC1G57DW-7

Diodes Incorporated

74LVC1G57DW-7 by Diodes Incorporated

74LVC1G57DW-7 by Diodes Inc. is a CMOS logic IC with Schmitt Trigger feature, operating at -40 to 125 °C. It has a propagation delay of 7.9 ns at Vsup of 3.3V and can handle load capacitance of 50 pF. Ideal for automotive applications due to its small form factor and low power consumption.

Median Price

$0.037

Lifecycle Status

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15

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1k+

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RS (Exports)

UK . 120 parts In-Stock

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$0.020

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DigiKey

USA . 562 parts In-Stock

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$0.130

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$0.062

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$0.051

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$0.045

562

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$0.045

RS Americas

USA . 120 parts In-Stock

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$0.182

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$0.142

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$0.113

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Arrow

USA . 165,000 parts In-Stock

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Avnet

USA . 9,000 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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TME

Poland . 794 parts In-Stock

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$0.130

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$0.061

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$0.050

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$0.046

794

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IBS Electronics

USA . 102,000 parts In-Stock

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Vyrian

USA . 64,050 parts In-Stock

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Chip Stock

USA . 17,810 parts In-Stock

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NAC Semi

USA . 9,000 parts In-Stock

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Classic Components Corporation

USA . 6,668 parts In-Stock

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Bristol Electronics

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VNN

France . 805 parts In-Stock

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Ampacity Inc.

Singapore . 64,052 parts In-Stock

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$0.021

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Semicontronic

India . 55,569 parts In-Stock

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Continental Prestige Electronics

USA . 1,108 parts In-Stock

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Argo Parts USA

USA . 1,004 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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$8.064

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Aztec Data Supply Inc.

USA . 2,273 parts In-Stock

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$8.760

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RC Electronics

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Lixinc

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Allen Electronics Distributors

USA . 100 parts In-Stock

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Overview

Enhance your electronic designs with the 74LVC1G57DW-7 by Diodes Incorporated. Known for their top-notch quality and innovation, Diodes Incorporated delivers exceptional performance in the category of Other Function Logic ICs. This versatile product offers a fast propagation delay of 7.9 ns, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C, this logic IC provides reliable and efficient functionality in automotive settings. Trust Diodes Incorporated to provide you with cutting-edge technology that exceeds expectations. Elevate your projects with the 74LVC1G57DW-7 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY for the package body material provides durability and protection for the internal components of the IC, ensuring reliable performance.

Propagation Delay At Nominal Supply: 7.9 ns

Low propagation delay at nominal supply voltage allows for fast operation and response times, making this IC suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts and designs, making it easy to incorporate this IC into existing systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common nominal supply voltage of 3.3V, making it compatible with a wide range of applications and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures efficient signal transmission and minimal signal distortion, improving overall performance.

Power Supplies (V): 3.3

Consistent power supply at 3.3V ensures stable operation and reliable functionality of the IC.

No. of Terminals: 6

Six terminals provide ample connectivity options for interfacing with other components, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for compact and space-saving integration into electronic devices.

Maximum I (ol): 24 Amp

High maximum output current of 24 Amp allows for driving power-hungry loads without the need for additional external components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in extreme environmental conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables operation in cold environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures strong electrical connections for reliable operation.

Terminal Position: DUAL

Dual terminal position allows for easy mounting and secure connections, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1 mm enables slim and compact designs, ideal for space-constrained applications.

Width: 1.25 mm

Narrow width of 1.25 mm allows for high-density mounting on PCBs, optimizing space utilization in electronic systems.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage of 1.65V ensures efficient operation even in low-power scenarios, improving energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time of 30 seconds at peak reflow temperature of 260°C ensures safe and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable soldering and ensures the durability of the IC during assembly.

Length: 2 mm

Compact length of 2 mm enables a small form factor and facilitates space-efficient integration in electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable performance in automotive applications, meeting industry standards for quality and durability.

Schmitt Trigger: YES

Built-in Schmitt trigger feature provides noise immunity and ensures stable output signals, enhancing the reliability of the IC in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this IC energy-efficient and reliable in operation.

Terminal Form: GULL WING

Gull-wing terminal form allows for easy surface mounting and secure solder connections, ensuring robust electrical connectivity in the system.

Packing Method: TR

TR packing method provides convenient tape and reel packaging for automated assembly processes, improving efficiency and reducing labor costs.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm enables high-density mounting on PCBs, optimizing board real estate and enabling compact system designs.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range of 5.5V allows for versatile compatibility with various power sources, offering flexibility in system design.

Technical Specifications

Other Function Logic ICs 74LVC1G57DW-7 attributes and parameters. Explore more Other Function Logic ICs devices from Diodes Incorporated

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G57DW-7 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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