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74LVC1G57GW

NXP Semiconductors

74LVC1G57GW by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GW is a CMOS logic IC with 7.9ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and can handle load capacitance of 50pF. The package is small outline, thin profile, with dual terminals and Schmitt Trigger technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip Stock

USA . 65,200 parts In-Stock

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Cyclops Electronics Ltd

UK . 15,386 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

Germany . 2,160 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

USA . 1,994 parts In-Stock

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Vyrian

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VNN

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Goldney Electronics S.L.

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Nova Conductors

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Anansix

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AZTECH Wire

Italy . 8,252 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 550 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Semicontronic

India . 1,136 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,139 parts In-Stock

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Ampacity Inc.

Singapore . 1,163 parts In-Stock

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Metaverse IC Inc.

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Overview

Unlock limitless possibilities with the NXP Semiconductors 74LVC1G57GW, a high-quality Other Function Logic IC that promises exceptional performance and reliability. Manufactured by industry leaders, NXP Semiconductors, this product offers unparalleled value and benefits to customers across various applications. With a compact design and impressive features, this logic IC is the perfect solution for your circuit needs. Experience efficiency and innovation like never before with the 74LVC1G57GW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay ensures efficient performance of the logic IC, making it suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in reducing power consumption and is ideal for portable electronic devices.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stability and reliable operation of the logic IC in various circuit configurations.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes the IC suitable for use in automotive and industrial applications where temperature fluctuations are common.

Schmitt Trigger: YES

Schmitt trigger input helps in cleaning up noisy signals, ensuring reliable logic level transitions in the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs 74LVC1G57GW attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G57GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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