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CD74HC670E

Texas Instruments

CD74HC670E by Texas Instruments

CD74HC670E by Texas Instruments is a 4-bit logic IC with a propagation delay of 42ns at 4.5V, featuring 3-STATE output characteristics. It operates in temperatures ranging from -55 to 125°C and has a max supply voltage of 6V. Ideal for military-grade applications requiring high-speed data processing in compact spaces.

Median Price

$2.118

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,104 parts In-Stock

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$2.760

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$1.689

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$1.496

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$1.419

1,104

$2.760

$1.689

$1.496

$1.419

Mouser Electronics

USA . 873 parts In-Stock

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$2.760

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$1.680

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$1.490

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$1.410

873

$2.760

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Rochester

USA . 4,343 parts In-Stock

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Verical

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Arrow

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$0.930

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Vyrian

USA . 2,340 parts In-Stock

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$0.808

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Digiode

USA . 815 parts In-Stock

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TME

Poland . 106 parts In-Stock

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$1.390

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DigiKey Marketplace

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SPM Sales

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Florida Circuit

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Corel Iberica Componentes, S.L.

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ComSIT Distribution GmbH

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PC Components Company LLC

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Bristol Electronics

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LWI Electronics Inc

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ICP Electronique

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R&J Components

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Inland Empire Components Inc.

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ECAB

Sweden . 40 parts In-Stock

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Prism Electronics

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Mil-Aero Solutions, Inc.

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ABC Electronics Ltd.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Resion

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Semi Source

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Corphita

USA . 1,936 parts In-Stock

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$0.999

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Parana Technologies

USA . 2,328 parts In-Stock

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$14.746

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$15.187

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DigiPath Technology Company

USA . 1,793 parts In-Stock

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$16.237

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ChromeModa Solutions

Germany . 5,589 parts In-Stock

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IDEA Electronic Components Group

UK . 1,548 parts In-Stock

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$14.911

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QUARKTWIN TECHNOLOGY LTD

USA . 27,970 parts In-Stock

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Perfect Parts

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Supply Digital

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Infinite Electronics LLP (Excess)

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Northwest PG Solutions

USA . 1,229 parts In-Stock

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Assy Fe

Spain . 538 parts In-Stock

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Native Components

USA . 264 parts In-Stock

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$4.307

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Overview

Unlock the power of cutting-edge technology with the CD74HC670E by Texas Instruments. This top-notch Other Function Logic IC boasts high-quality materials and superior craftsmanship, setting it apart from the competition. Ideal for a variety of applications, this product offers unmatched performance and reliability to meet your needs. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the CD74HC670E. Elevate your projects to new heights with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Propagation Delay At Nominal Supply: 42 ns

Fast response time ensures efficient operation of the logic IC.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for reliable performance of the IC.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for a variety of environments.

Output Characteristics: 3-STATE

Allows for multiple output states, increasing flexibility in usage.

Maximum Seated Height: 5.08 mm

Compact size makes it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, conserving energy.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Temperature Grade: MILITARY

Designed to meet stringent military-grade requirements for reliability and performance.

Technical Specifications

Other Function Logic ICs CD74HC670E attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HC670E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-425-2310, 5962014252310

NIIN

014252310

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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