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CD74ACT297MG4

Texas Instruments

CD74ACT297MG4 by Texas Instruments

CD74ACT297MG4 by Texas Instruments is a CMOS logic IC with 16 terminals, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and peak reflow temperature of 260°C. This rectangular package is suitable for military-grade applications requiring small outline surface-mount components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,359 parts In-Stock

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Digiode

USA . 1,309 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 809 parts In-Stock

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$8.669

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$8.669

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Parana Technologies

USA . 326 parts In-Stock

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$29.442

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$59.398

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DigiPath Technology Company

USA . 433 parts In-Stock

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$32.419

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$29.826

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433

$32.419

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ChromeModa Solutions

Germany . 4,824 parts In-Stock

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$33.081

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$27.126

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$33.081

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

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$33.081

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$31.427

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$29.773

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$33.081

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One Stop Electronics

USA . 355 parts In-Stock

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$52.000

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Native Components

USA . 672 parts In-Stock

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$74.952

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$71.954

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Northwest PG Solutions

USA . 1,587 parts In-Stock

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$82.448

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Corphita

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Overview

Enhance your electronic projects with the CD74ACT297MG4 by Texas Instruments, a top-quality Other Function Logic IC that promises reliability and performance. Texas Instruments is known for its innovative solutions, and this product is no exception. With a wide range of applications in various industries, this IC offers exceptional value to customers looking for efficiency and precision in their designs. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic IC, making it reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding environments.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold conditions without performance issues, allowing for versatile usage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Other Function Logic ICs CD74ACT297MG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT297MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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