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SN74CB3T16212DGVRE4

Texas Instruments

SN74CB3T16212DGVRE4 by Texas Instruments

SN74CB3T16212DGVRE4 by Texas Instruments is a CMOS logic IC with 56 terminals, operating at temperatures from -40 to 85°C. It has power supplies of 2.5/3.3V and comes in a small outline package for surface mounting applications. Ideal for industrial use due to its robust design and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,097 parts In-Stock

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4,097

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Digiode

USA . 3,101 parts In-Stock

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3,101

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$16.933

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320

$16.933

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Parana Technologies

USA . 455 parts In-Stock

1+ parts

$27.271

100+ parts

$2,532.561

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$24.544

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455

$27.271

$2,532.561

$24.544

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DigiPath Technology Company

USA . 582 parts In-Stock

1+ parts

$30.029

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$27.627

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582

$30.029

$27.627

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IDEA Electronic Components Group

UK . 541 parts In-Stock

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$30.642

100+ parts

$29.110

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$27.578

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541

$30.642

$29.110

$27.578

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ChromeModa Solutions

Germany . 153 parts In-Stock

1+ parts

$30.642

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$25.126

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153

$30.642

$25.126

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One Stop Electronics

USA . 698 parts In-Stock

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$58.000

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698

$58.000

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Corphita

USA . 1,814 parts In-Stock

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Overview

Unleash the power of innovation with the SN74CB3T16212DGVRE4 by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments delivers top-notch quality and reliability. This versatile Other Function Logic IC is designed to excel in various applications, providing customers with unmatched value and performance. Say goodbye to limitations and hello to endless possibilities with this cutting-edge product. Elevate your projects and experience the advantages that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and offers compatibility with standard PCB layouts and designs.

Power Supplies (V): 2.5/3.3

Offers both 2.5V and 3.3V power supply options, providing flexibility in designing and operating the circuit.

No. of Terminals: 56

56 terminals allow for a wide range of connections and functionalities, making the product versatile for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a small outline, thin profile, and shrink pitch saves space on the PCB and enables high-density mounting.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures the IC can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the IC to function reliably in cold environments or during temperature fluctuations.

Terminal Position: DUAL

Dual terminal position enhances connection stability and reliability, reducing the risk of signal interference or disconnection.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the IC can operate in harsh industrial environments with consistency and reliability.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making the IC energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering onto the PCB, ensuring secure connections and robust performance.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm enables precise connections and facilitates high-density mounting, optimizing space utilization on the PCB.

Technical Specifications

Other Function Logic ICs SN74CB3T16212DGVRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Trade Compliance

SN74CB3T16212DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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