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MC14549BDWR2

Onsemi

MC14549BDWR2 by Onsemi

MC14549BDWR2 by Onsemi is a CMOS logic IC with 16 terminals and a supply voltage range of 3-18V. It operates b/w -55 to 125 °C, making it suitable for military-grade applications. The small outline package measures 10.3mm x 7.5mm x 2.65mm, ideal for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,363 parts In-Stock

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Vyrian

USA . 2,033 parts In-Stock

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2,033

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Distributors (Availability)

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TANS Electronics

Latvia . 6,585 parts In-Stock

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6,585

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Problanco Electronics

Mexico . 6,439 parts In-Stock

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6,439

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Kulean Microsystems

USA . 2,140 parts In-Stock

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Corphita

USA . 1,685 parts In-Stock

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SupplyDigital Components

Austria . 1,379 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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694

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Enhance your electronics projects with the MC14549BDWR2 by Onsemi. Crafted with precision and expertise, this high-quality logic IC is designed to deliver exceptional performance and reliability. Ideal for a wide range of applications, this product offers unparalleled value, benefits, and advantages to customers looking to elevate their designs. Trust in Onsemi's reputation for excellence in manufacturing and innovation, and discover the endless possibilities that the MC14549BDWR2 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology makes it easier for manufacturers to assemble the IC onto a PCB, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this IC compatible with a wide range of systems and applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this IC can be used in extreme cold environments without performance issues.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable for various applications.

Technical Specifications

Other Function Logic ICs MC14549BDWR2 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

SERIAL OUTPUT, ALL CONTROL INPUTS POSITIVE-EDGE TRIGGERED

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC14549BDWR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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