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5962-9204601M2X

Texas Instruments

5962-9204601M2X by Texas Instruments

5962-9204601M2X by Texas Instruments is a MILITARY-grade TTL logic IC with TRUE output polarity. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it suitable for military applications requiring reliable performance in extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,466 parts In-Stock

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3,466

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Digiode

USA . 2,554 parts In-Stock

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2,554

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 846 parts In-Stock

1+ parts

$14.673

100+ parts

-

1k+ parts

$15.112

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846

$14.673

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$15.112

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DigiPath Technology Company

USA . 412 parts In-Stock

1+ parts

$16.156

100+ parts

$14.864

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412

$16.156

$14.864

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ChromeModa Solutions

Germany . 3,692 parts In-Stock

1+ parts

$16.486

100+ parts

$13.519

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3,692

$16.486

$13.519

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$16.486

100+ parts

$15.662

1k+ parts

$14.837

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1,668

$16.486

$15.662

$14.837

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AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$18.793

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762

$18.793

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One Stop Electronics

USA . 666 parts In-Stock

1+ parts

$46.000

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666

$46.000

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Corphita

USA . 3,673 parts In-Stock

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3,673

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Northwest PG Solutions

USA . 2,224 parts In-Stock

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Native Components

USA . 630 parts In-Stock

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630

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Overview

Elevate your electronic projects with the 5962-9204601M2X by Texas Instruments, a top-tier manufacturer known for producing high-quality components. This Other Function Logic IC offers unmatched reliability and performance, making it perfect for a wide range of applications. With its MIL-STD-883 screening level and military-grade temperature grade, this chip carrier ensures optimal functionality even in harsh environments. Trust Texas Instruments to deliver innovative solutions that exceed expectations. Choose the 5962-9204601M2X for unparalleled value and efficiency in your next design.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making this product suitable for a wide range of operating conditions.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during the assembly process.

Screening Level: MIL-STD-883

Complies with stringent military standards for quality and reliability, ensuring consistent performance.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage compatibility ensures easy integration into existing systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style allows for compact and efficient design, saving space on the PCB.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, expanding the range of applications where this product can be used.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments, making it suitable for a variety of working conditions.

Technology: TTL

Utilizes TTL technology known for its high-speed performance and reliability, making this product ideal for applications requiring fast data processing.

Technical Specifications

Other Function Logic ICs 5962-9204601M2X attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

5962-9204601M2X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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