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SN74LS396J

Texas Instruments

SN74LS396J by Texas Instruments

SN74LS396J by Texas Instruments is a TTL IC with 16 terminals, operating at 0-70°C. It has a supply voltage range of 4.75-5.25V and is used in various applications requiring Other Function Logic ICs in commercial-grade temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,795 parts In-Stock

1+ parts

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6,795

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Digiode

USA . 938 parts In-Stock

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938

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GES GmbH

Germany . 5 parts In-Stock

1+ parts

-

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 787 parts In-Stock

1+ parts

$11.126

100+ parts

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787

$11.126

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Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

$22.642

100+ parts

-

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$23.302

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1,964

$22.642

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$23.302

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DigiPath Technology Company

USA . 2,352 parts In-Stock

1+ parts

$24.931

100+ parts

$22.937

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2,352

$24.931

$22.937

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ChromeModa Solutions

Germany . 3,404 parts In-Stock

1+ parts

$25.440

100+ parts

$20.861

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3,404

$25.440

$20.861

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IDEA Electronic Components Group

UK . 1,501 parts In-Stock

1+ parts

$25.440

100+ parts

$24.168

1k+ parts

$22.896

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1,501

$25.440

$24.168

$22.896

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One Stop Electronics

USA . 267 parts In-Stock

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$35.000

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267

$35.000

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Corphita

USA . 1,026 parts In-Stock

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1,026

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Overview

Unlock the power of cutting-edge technology with the SN74LS396J by Texas Instruments. Crafted with precision and expertise, this high-quality logic IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless integration and efficient operation. Elevate your projects with the innovative features and superior functionality of the SN74LS396J, setting new standards in the industry. Choose Texas Instruments for exceptional quality and value that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures high durability and reliability, making this product suitable for harsh environmental conditions.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Technology: TTL

The use of Transistor-Transistor Logic (TTL) technology ensures fast switching speeds and low power consumption, making this product efficient and reliable.

Technical Specifications

Other Function Logic ICs SN74LS396J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS396J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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