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5962-9204601M2A

Texas Instruments

5962-9204601M2A by Texas Instruments

Texas Instruments 5962-9204601M2A is a TTL logic IC with 20 terminals in a chip carrier package. It operates at -55 to 125 °C, with propagation delay of 15 ns and max power supply current of 55 mA. Ideal for military applications requiring fast signal processing in harsh environments.

Median Price

$27.552

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$24.490

1k+ parts

$21.910

10k+ parts

$20.620

78

-

$24.490

$21.910

$20.620

DigiKey

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

78

-

-

-

-

Verical

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$30.613

1k+ parts

$27.387

10k+ parts

$25.775

78

-

$30.613

$27.387

$25.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,698 parts In-Stock

1+ parts

$21.612

100+ parts

-

1k+ parts

-

10k+ parts

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3,698

$21.612

-

-

-

Vyrian

USA . 7,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,806

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$8.703

100+ parts

-

1k+ parts

$9.383

10k+ parts

-

1,203

$8.703

-

$9.383

-

DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

$9.583

100+ parts

$8.817

1k+ parts

-

10k+ parts

-

1,302

$9.583

$8.817

-

-

ChromeModa Solutions

Germany . 3,616 parts In-Stock

1+ parts

$9.779

100+ parts

$8.019

1k+ parts

-

10k+ parts

-

3,616

$9.779

$8.019

-

-

IDEA Electronic Components Group

UK . 2,242 parts In-Stock

1+ parts

$9.779

100+ parts

$9.290

1k+ parts

$8.801

10k+ parts

-

2,242

$9.779

$9.290

$8.801

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Corphita

USA . 3,909 parts In-Stock

1+ parts

$20.475

100+ parts

-

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-

10k+ parts

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3,909

$20.475

-

-

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Microchip USA

USA . 1,803 parts In-Stock

1+ parts

$55.410

100+ parts

$54.440

1k+ parts

$53.960

10k+ parts

$53.480

1,803

$55.410

$54.440

$53.960

$53.480

Northwest PG Solutions

USA . 1,279 parts In-Stock

1+ parts

-

100+ parts

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1,279

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Native Components

USA . 465 parts In-Stock

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465

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Overview

Unlock the power of cutting-edge technology with the 5962-9204601M2A by Texas Instruments. Crafted with precision and expertise, this high-quality Other Function Logic IC offers unparalleled performance and reliability for a wide range of applications. Whether you're in the military, aerospace, or industrial sector, this versatile chip carrier is designed to exceed your expectations. With fast propagation delay, low power consumption, and a wide operating temperature range, this TTL technology device ensures seamless integration and optimal functionality. Upgrade your projects today with the Texas Instruments advantage.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 15 ns

The low propagation delay of 15 ns ensures fast and efficient operation of the logic IC.

Surface Mount: YES

Being surface mountable makes it easy to integrate this logic IC into modern PCB designs, saving space and enhancing assembly efficiency.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and robustness suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard voltage of 5V makes it compatible with a wide range of digital systems and power sources.

Maximum I (ol): 24 Amp

With a high maximum output current of 24 Amp, this logic IC can drive significant loads efficiently.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 125°C allows this IC to function reliably in extreme environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with existing TTL-based systems and provides reliable logic operations.

Maximum Power Supply Current (ICC): 55 mA

The low power supply current requirement of 55 mA helps in reducing power consumption and heat generation for energy-efficient operation.

Technical Specifications

Other Function Logic ICs 5962-9204601M2A attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Logic IC:Other

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

5962-9204601M2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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