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5962-90503012A

Texas Instruments

5962-90503012A by Texas Instruments

Texas Instruments 5962-90503012A is a MILITARY-grade TTL IC with 20 terminals in a CHIP CARRIER package. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,882 parts In-Stock

1+ parts

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100+ parts

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4,882

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Digiode

USA . 4,582 parts In-Stock

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4,582

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 472 parts In-Stock

1+ parts

$0.052

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

472

$0.052

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-

$0.049

AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$11.349

100+ parts

-

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339

$11.349

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One Stop Electronics

USA . 1,379 parts In-Stock

1+ parts

$13.000

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1,379

$13.000

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Parana Technologies

USA . 107 parts In-Stock

1+ parts

$15.678

100+ parts

-

1k+ parts

$16.048

10k+ parts

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107

$15.678

-

$16.048

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DigiPath Technology Company

USA . 1,653 parts In-Stock

1+ parts

$17.264

100+ parts

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1,653

$17.264

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ChromeModa Solutions

Germany . 3,592 parts In-Stock

1+ parts

$17.616

100+ parts

$14.445

1k+ parts

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3,592

$17.616

$14.445

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$17.616

100+ parts

$16.735

1k+ parts

$15.854

10k+ parts

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883

$17.616

$16.735

$15.854

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Northwest PG Solutions

USA . 915 parts In-Stock

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915

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Corphita

USA . 134 parts In-Stock

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134

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Overview

Enhance your electronic projects with the 5962-90503012A by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers exceptional performance and reliability. This Other Function Logic IC is versatile, making it ideal for a wide range of applications. With its MIL-STD-883 screening level and military-grade temperature grade, this IC ensures durability and stability even in challenging environments. Upgrade your designs with this high-value product that offers unbeatable benefits and advantages to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides excellent durability and reliability, making this product suitable for use in harsh environments.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and simplifying assembly processes.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 ensures high quality and reliability, making this product ideal for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a commonly used standard in many electronic systems, allowing for easy compatibility and integration.

No. of Terminals: 20

Having 20 terminals provides versatility and functionality, allowing for connection to multiple external components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity and efficient heat dissipation, ensuring optimal performance under high operating temperatures.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme heat conditions without compromising functionality.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance even in cold environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance.

Technology: TTL

Utilizing TTL technology ensures fast switching speeds and low power consumption, making this product suitable for high-speed digital applications.

Technical Specifications

Other Function Logic ICs 5962-90503012A attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Qualified

Screening Level:

MIL-STD-883

Sub-Category:

Logic IC:Other

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

5962-90503012A Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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