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5962-9050301EX

Texas Instruments

5962-9050301EX by Texas Instruments

5962-9050301EX by Texas Instruments is a MIL-STD-883 compliant TTL IC with 16 terminals. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5V to 5.5V. Ideal for military applications due to its ceramic package and through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,270 parts In-Stock

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3,270

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Digiode

USA . 645 parts In-Stock

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645

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Distributors (Availability)

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AZTECH Wire

Italy . 420 parts In-Stock

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$17.002

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420

$17.002

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Parana Technologies

USA . 1,706 parts In-Stock

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$26.211

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$26.804

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$26.211

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ChromeModa Solutions

Germany . 5,157 parts In-Stock

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$29.451

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$24.150

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$29.451

$24.150

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IDEA Electronic Components Group

UK . 18 parts In-Stock

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$29.451

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$27.978

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$26.506

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18

$29.451

$27.978

$26.506

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One Stop Electronics

USA . 1,169 parts In-Stock

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$49.000

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$49.000

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Corphita

USA . 4,786 parts In-Stock

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DigiPath Technology Company

USA . 2,300 parts In-Stock

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$26.553

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Northwest PG Solutions

USA . 274 parts In-Stock

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274

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Native Components

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Overview

Unleash the power of innovation with the 5962-9050301EX by Texas Instruments. Crafted with unparalleled precision and reliability, this cutting-edge logic IC is designed to elevate your projects to new heights. Whether you're in the aerospace, defense, or industrial sector, this military-grade component will exceed your expectations with its superior performance and durability. Embrace the future of technology with Texas Instruments and experience the seamless integration, exceptional quality, and unmatched value that this product brings to your work. Elevate your creations to perfection with the 5962-9050301EX.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability, making this product suitable for harsh environments.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and reliability in performance, meeting stringent military standards.

Nominal Supply Voltage: 5V

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125°C

Can withstand high operating temperatures of up to 125°C, making it suitable for use in demanding industrial and military environments.

Technology: TTL

Utilizes TTL technology, known for its fast switching speeds and reliability, making it ideal for applications requiring precise timing and logic operations.

Technical Specifications

Other Function Logic ICs 5962-9050301EX attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

5962-9050301EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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