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NC7SP58P6X

Onsemi

NC7SP58P6X by Onsemi

The Onsemi NC7SP58P6X is a CMOS logic IC with Schmitt Trigger feature. It operates at 1.2V/3.3V, has 55ns propagation delay, and can handle load capacitance of 30pF. Ideal for industrial applications requiring fast response time in compact designs due to its small outline package and low power consumption.

Median Price

$0.107

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

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$0.107

1k+ parts

$0.089

10k+ parts

$0.079

2,000

-

$0.107

$0.089

$0.079

Flip Electronics (Authorized)

USA . 1,967 parts In-Stock

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1,967

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.061

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900

$0.061

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Digiode

USA . 1,246 parts In-Stock

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$0.065

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$0.065

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DigiKey Marketplace

USA . 3,000 parts In-Stock

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Vyrian

USA . 2,362 parts In-Stock

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2,362

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Flip Electronics

USA . 1,967 parts In-Stock

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J2 Sourcing AB

Sweden . 1,230 parts In-Stock

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Prism Electronics

USA . 64 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 16 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,220 parts In-Stock

1+ parts

$0.058

100+ parts

$0.057

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$0.056

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2,220

$0.058

$0.057

$0.056

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Ampacity Inc.

Singapore . 2,193 parts In-Stock

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$0.058

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Continental Prestige Electronics

USA . 4,559 parts In-Stock

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$0.061

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$0.060

4,559

$0.061

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$0.060

Argo Parts USA

USA . 2,305 parts In-Stock

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$0.061

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$0.059

2,305

$0.061

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$0.059

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.061

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$0.060

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$0.061

$0.060

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Corphita

USA . 2,021 parts In-Stock

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$0.061

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Corohmni

South Africa . 270 parts In-Stock

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$0.068

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Perfect Parts

USA . 61,840 parts In-Stock

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RC Electronics

USA . 55,000 parts In-Stock

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$0.050

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$0.050

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$0.050

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$0.050

$0.050

$0.050

Metaverse IC Inc.

Canada . 11,280 parts In-Stock

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Microchip USA

USA . 8,774 parts In-Stock

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Kulean Microsystems

USA . 6,228 parts In-Stock

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Problanco Electronics

Mexico . 6,126 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,866 parts In-Stock

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SupplyDigital Components

Austria . 5,689 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Component Stockers USA

USA . 2,944 parts In-Stock

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TANS Electronics

Latvia . 1,389 parts In-Stock

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UHIMA Technologies

Türkiye . 740 parts In-Stock

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Supply Digital

USA . 175 parts In-Stock

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Overview

Experience the seamless performance and reliability of the NC7SP58P6X by Onsemi, a cutting-edge Other Function Logic IC designed to meet your application needs. With a focus on quality and innovation, Onsemi sets itself apart as a trusted manufacturer in the industry. This versatile component offers valuable benefits such as fast propagation delay, low power consumption, and a wide operating temperature range. Ideal for industrial applications, this IC delivers exceptional functionality and efficiency, making it a must-have solution for your electronic projects. Trust Onsemi to provide top-tier products that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the IC.

Propagation Delay: 55 ns

The low propagation delay ensures quick signal processing and efficient operation of the logic IC.

Surface Mount: YES

Being surface mountable makes installation and soldering easy, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V makes this IC energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC reliable and efficient in various applications.

Technical Specifications

Other Function Logic ICs NC7SP58P6X attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

P

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

55 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NC7SP58P6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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