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SN74ALS2442FNR

Texas Instruments

SN74ALS2442FNR by Texas Instruments

SN74ALS2442FNR by Texas Instruments is a TTL logic IC with 20 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.75-5.25V and is suitable for commercial applications requiring square chip carrier package style in surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,763 parts In-Stock

1+ parts

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6,763

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Digiode

USA . 981 parts In-Stock

1+ parts

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981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 617 parts In-Stock

1+ parts

$13.685

100+ parts

-

1k+ parts

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617

$13.685

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Parana Technologies

USA . 403 parts In-Stock

1+ parts

$15.443

100+ parts

-

1k+ parts

$15.823

10k+ parts

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403

$15.443

-

$15.823

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DigiPath Technology Company

USA . 1,303 parts In-Stock

1+ parts

$17.005

100+ parts

$15.645

1k+ parts

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1,303

$17.005

$15.645

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IDEA Electronic Components Group

UK . 595 parts In-Stock

1+ parts

$17.352

100+ parts

$16.484

1k+ parts

$15.617

10k+ parts

-

595

$17.352

$16.484

$15.617

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ChromeModa Solutions

Germany . 52 parts In-Stock

1+ parts

$17.352

100+ parts

$14.229

1k+ parts

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52

$17.352

$14.229

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One Stop Electronics

USA . 615 parts In-Stock

1+ parts

$54.000

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615

$54.000

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Corphita

USA . 2,967 parts In-Stock

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2,967

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Overview

Discover the unparalleled quality and reliability of the SN74ALS2442FNR by Texas Instruments, a leading manufacturer in the industry. This versatile Other Function Logic IC offers a wide range of applications, making it an essential component for various electronic devices. With a nominal supply voltage of 5V and commercial temperature grade, this chip carrier package is designed for optimal performance and durability. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with the value and benefits you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with existing systems and components seamless.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions and maintain optimal performance.

Technology: TTL

Using TTL technology ensures high speed and reliable logic operations, making this product suitable for demanding applications.

Technical Specifications

Other Function Logic ICs SN74ALS2442FNR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

SN74ALS2442FNR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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