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74AUP1G58GW,125

NXP Semiconductors

74AUP1G58GW,125 by NXP Semiconductors

NXP Semiconductors' 74AUP1G58GW,125 is a CMOS logic IC with Schmitt Trigger. It operates at -40 to 125 °C and has a propagation delay of 24.1 ns at Vsup of 1.1V. With a load capacitance of 30 pF, it's ideal for automotive applications requiring fast signal processing in small form factors.

Median Price

$0.081

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 14,870 parts In-Stock

1+ parts

$0.190

100+ parts

$0.089

1k+ parts

$0.080

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$0.079

14,870

$0.190

$0.089

$0.080

$0.079

DigiKey

USA . 2,650 parts In-Stock

1+ parts

$0.190

100+ parts

$0.097

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$0.080

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$0.071

2,650

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$0.097

$0.080

$0.071

Arrow

USA . 8,914 parts In-Stock

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$0.052

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Verical

USA . 8,914 parts In-Stock

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$0.052

Chip1Stop

Japan . 8,914 parts In-Stock

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$0.081

8,914

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.121

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Digiode

USA . 4,890 parts In-Stock

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$0.218

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Chip Stock

USA . 68,000 parts In-Stock

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VNN

France . 7,994 parts In-Stock

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Vyrian

USA . 6,269 parts In-Stock

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Anansix

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,370 parts In-Stock

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$0.056

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$0.056

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AZTECH Wire

Italy . 8,698 parts In-Stock

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$0.080

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Aranea Global

USA . 1,000 parts In-Stock

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$0.118

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$0.114

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$0.118

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Continental Prestige Electronics

USA . 3,033 parts In-Stock

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$0.121

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$0.118

3,033

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Argo Parts USA

USA . 153 parts In-Stock

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153

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Corphita

USA . 3,001 parts In-Stock

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Eastek

USA . 6,000 parts In-Stock

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$0.090

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 1,173 parts In-Stock

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Supply Digital

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Formix International (Excess)

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Overview

Discover the cutting-edge 74AUP1G58GW,125 from NXP Semiconductors, a top-tier manufacturer known for its high-quality products. This versatile Other Function Logic IC is designed for a wide range of applications, offering unparalleled performance and reliability. With a compact design, low power consumption, and automotive-grade temperature tolerance, this IC delivers exceptional value to customers in need of efficient and dependable solutions. Upgrade your project with the NXP 74AUP1G58GW,125 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, ideal for portable applications.

Propagation Delay at Nominal Supply: 24.1 ns

With a low propagation delay of 24.1 ns at nominal supply, this product offers fast processing speeds for efficient operation.

Surface Mount: YES

Being surface mount compatible allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup: 1.1V

Operating at a low nominal supply voltage of 1.1V, this product helps in reducing power consumption and extending battery life.

Load Capacitance (CL): 30 pF

With a load capacitance of 30 pF, this product can drive capacitive loads efficiently without compromising performance.

Power Supplies (V): 1.2/3.3V

Supporting multiple power supply voltages of 1.2V and 3.3V, this product offers flexibility in different operating environments.

No. of Terminals: 6

Featuring 6 terminals, this product provides versatile connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style makes this product compact and suitable for space-constrained applications.

Maximum I (ol): 1.7 Amp

With a maximum output current of 1.7 Amp, this product is capable of driving high-current loads efficiently.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for both extreme cold and hot environments.

Terminal Finish: Tin (Sn)

The tin terminal finish ensures good conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers enhanced flexibility in circuit connections.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product can be easily mounted in compact spaces.

Width: 1.25 mm

The width of 1.25 mm makes this product suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 0.8V

With a minimum supply voltage requirement of 0.8V, this product can operate efficiently even at low power levels.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this product ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the product during assembly processes.

Length: 2 mm

The length of 2 mm makes this product compact and suitable for applications where space is limited.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for temperature performance and reliability.

Schmitt Trigger: YES

Featuring a Schmitt trigger function, this product ensures better noise immunity and stable output signals.

Technology: CMOS

Built on CMOS technology, this product offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections for improved durability.

Packing Method: TR

This product is packed in tape and reel format, making it convenient for automated assembly processes.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for precise and compact PCB layout designs.

Maximum Supply Voltage (Vsup): 3.6V

Supporting a maximum supply voltage of 3.6V, this product is suitable for a wide range of applications.

Technical Specifications

Other Function Logic ICs 74AUP1G58GW,125 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

24.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G58GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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