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74AUP1G97GW,125

NXP Semiconductors

74AUP1G97GW,125 by NXP Semiconductors

74AUP1G97GW,125 by NXP Semiconductors is a CMOS logic IC with a propagation delay of 22.2 ns and a load capacitance of 30 pF. It is commonly used in automotive applications due to its small size (1.25mm width) and high temperature tolerance (up to 125°C).

Median Price

$0.238

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Arrow

USA . 374 parts In-Stock

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$0.249

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$0.142

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$0.090

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DigiKey

USA . 5,295 parts In-Stock

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$0.300

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$0.159

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$0.133

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$0.101

5,295

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Newark

USA . 8,235 parts In-Stock

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$0.525

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$0.322

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Farnell

UK . 8,685 parts In-Stock

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Element14

Singapore . 8,685 parts In-Stock

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$0.327

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Future Electronics

Canada . 6,000 parts In-Stock

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EBV Elektronik

Germany . 6,000 parts In-Stock

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Rochester

USA . 3,098 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 1,016 parts In-Stock

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$0.129

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Digiode

USA . 794 parts In-Stock

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$0.086

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Nova Conductors

Japan . 15 parts In-Stock

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Chip Stock

USA . 91,000 parts In-Stock

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Bristol Electronics

USA . 42,000 parts In-Stock

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$0.375

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$0.150

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$0.101

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$0.101

IBS Electronics

USA . 15,000 parts In-Stock

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Vyrian

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NAC Semi

USA . 6,000 parts In-Stock

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VNN

France . 3,188 parts In-Stock

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Lantek

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Anansix

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Sensible Micro Corp

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Distributors (Availability)

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Ampacity Inc.

Singapore . 25,639 parts In-Stock

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$0.076

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Corphita

USA . 2,176 parts In-Stock

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Component Stockers USA

USA . 40,386 parts In-Stock

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$0.090

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$0.170

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$0.110

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$0.080

40,386

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$0.080

AZTECH Wire

Italy . 11,464 parts In-Stock

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Argo Parts USA

USA . 3,794 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Corohmni

South Africa . 136 parts In-Stock

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$16.638

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QUARKTWIN TECHNOLOGY LTD

USA . 28,862 parts In-Stock

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Continental Prestige Electronics

USA . 11,335 parts In-Stock

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Perfect Parts

USA . 4,014 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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UNI Independent Distributors

Spain . 832 parts In-Stock

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Overview

Discover the 74AUP1G97GW,125 by NXP Semiconductors, a high-quality Other Function Logic IC designed to deliver exceptional performance. With its compact design and surface mount capability, this product is perfect for a wide range of applications. Whether you're working on automotive projects or other electronic systems, this logic IC provides reliable and efficient functionality. Offering a nominal supply voltage of 1.1V and maximum operating temperature of 125°C, it ensures optimal performance in various conditions. Experience the value and benefits of NXP Semiconductors' expertise with the 74AUP1G97GW,125 - a powerful solution for your electronic needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the product, making it suitable for various environments and applications.

Propagation Delay At Nominal Supply: 22.2 ns

With a fast propagation delay of 22.2 ns, this logic IC ensures quick and efficient signal processing, which is crucial in time-sensitive applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration and installation on PCBs, simplifying the assembly process and saving valuable space.

No. of Functions: 1

With a single function, this logic IC is straightforward and focused, providing a specific purpose and reducing complexity in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape enables easy handling and mounting, ensuring compatibility with standard board layouts and facilitating efficient manufacturing.

Nominal Supply Voltage / Vsup (V): 1.1

Operating at a nominal supply voltage of 1.1V, this logic IC offers energy efficiency and low power consumption, making it ideal for battery-powered devices.

Load Capacitance (CL): 30 pF

Designed to work with a load capacitance of 30 pF, this logic IC delivers reliable performance when connected to external capacitive loads, ensuring stable signal transmission.

Power Supplies (V): 1.2/3.3

With a wide operating voltage range of 1.2V to 3.3V, this logic IC offers versatility and compatibility with various power supply configurations, enhancing its usability.

No. of Terminals: 6

Featuring 6 terminals, this logic IC provides sufficient connectivity options for input and output signals, enabling seamless integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, with shrink pitch package style enables high-density mounting, allowing for more compact circuit designs and efficient space utilization.

Maximum I (ol): 1.7 Amp

With a maximum output sink current of 1.7 Amps, this logic IC can effectively drive high-current loads, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Designed to operate reliably at temperatures up to 125°C, this logic IC can withstand harsh environmental conditions, ensuring robust performance in extreme situations.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic IC remains functional even in cold environments, providing versatility for various applications.

Terminal Finish: Tin (Sn)

The tin terminal finish enhances solderability, ensuring secure and reliable connections during the manufacturing process, leading to improved product quality and longevity.

Terminal Position: DUAL

Featuring dual terminal positions, this logic IC allows for flexible board layout design options, accommodating different routing and circuit configurations.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this logic IC offers a low-profile design, enabling its use in space-constrained applications while facilitating efficient heat dissipation.

Width: 1.25 mm

With a compact width of 1.25 mm, this logic IC contributes to miniaturization efforts, making it suitable for applications requiring small form factors.

Minimum Supply Voltage (Vsup): 0.8 V

Operating at a minimum supply voltage of 0.8V, this logic IC maintains functionality even during low-power scenarios, ensuring efficiency and reliability in various power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this logic IC allows for reliable soldering, reducing the risk of component damage during manufacturing processes.

Peak Reflow Temperature °C: 260

Designed to withstand peak reflow temperatures of up to 260°C, this logic IC ensures robust solder joint integrity, ensuring reliable connections even under high-temperature conditions.

Length: 2 mm

With a compact length of 2 mm, this logic IC contributes to space-saving designs, providing flexibility for small-scale applications.

Temperature Grade: AUTOMOTIVE

Certified with an automotive temperature grade, this logic IC meets stringent industry standards, ensuring reliable operation in automotive electronics applications.

Schmitt Trigger: YES

Equipped with a Schmitt trigger, this logic IC offers improved noise immunity and signal stability, making it suitable for applications susceptible to signal distortions.

Technology: CMOS

Utilizing CMOS technology, this logic IC provides low power consumption, high noise immunity, and compatibility with a wide range of applications, making it a versatile choice.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this logic IC facilitates easy and secure solder connections, ensuring efficient manufacturing processes and reliable performance.

Packing Method: TR

Packaged in tape and reel (TR) format, this logic IC allows for automated handling during assembly, improving production efficiency and reducing manual labor requirements.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic IC supports high-density PCB layouts, enabling space-saving designs and efficient use of available board area.

Moisture Sensitivity Level (MSL): 1

Rated with a moisture sensitivity level of 1, this logic IC can withstand standard moisture exposure during manufacturing processes, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 3.6 V

Operating with a maximum supply voltage of 3.6V, this logic IC offers compatibility with higher voltage systems, expanding its range of applications.

Technical Specifications

Other Function Logic ICs 74AUP1G97GW,125 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

22.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G97GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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