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SN75430N

Texas Instruments

SN75430N by Texas Instruments

SN75430N by Texas Instruments is a 14-terminal IC with bipolar technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,819 parts In-Stock

1+ parts

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3,819

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Digiode

USA . 2,327 parts In-Stock

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2,327

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 181 parts In-Stock

1+ parts

$15.255

100+ parts

-

1k+ parts

$15.651

10k+ parts

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181

$15.255

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$15.651

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AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$16.709

100+ parts

-

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304

$16.709

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ChromeModa Solutions

Germany . 6,917 parts In-Stock

1+ parts

$17.140

100+ parts

$14.055

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-

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6,917

$17.140

$14.055

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

1+ parts

$17.140

100+ parts

$16.283

1k+ parts

$15.426

10k+ parts

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1,945

$17.140

$16.283

$15.426

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One Stop Electronics

USA . 661 parts In-Stock

1+ parts

$44.000

100+ parts

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661

$44.000

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Corphita

USA . 1,363 parts In-Stock

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1,363

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DigiPath Technology Company

USA . 261 parts In-Stock

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$15.453

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261

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$15.453

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Overview

Unleash the power of Texas Instruments with the SN75430N, a high-quality Other Function Logic IC that offers unparalleled performance and reliability. Designed for a wide range of applications, this versatile IC boasts a variety of benefits including precision engineering, durability, and ease of installation. Whether you're a DIY enthusiast or a seasoned professional, the SN75430N is sure to exceed your expectations and deliver exceptional value. Upgrade your projects today with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides good protection for the internal components, enhancing the overall durability of the product.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various types of circuits and systems, making it versatile for different applications.

No. of Terminals: 14

Having 14 terminals allows for more connections and functionalities, making this logic IC suitable for complex circuit designs.

Package Style: IN-LINE

In-line package style is space-efficient and organized, making it easier to design and assemble circuits with multiple components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this logic IC can withstand high temperatures, increasing its reliability in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures that the logic IC can function effectively even in cold conditions, adding to its versatility.

Terminal Position: DUAL

Dual terminal position allows for more stable connections and better signal integrity, improving the overall performance of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade means this logic IC is suitable for standard commercial applications, making it a versatile choice for various industries.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and high output power, making this logic IC ideal for applications that require high performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections, making installation and maintenance convenient for users.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this logic IC is compatible with standard PCB designs, facilitating easy integration into existing circuits.

Technical Specifications

Other Function Logic ICs SN75430N attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75430N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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