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SN75324JP4

Texas Instruments

SN75324JP4 by Texas Instruments

SN75324JP4 by Texas Instruments is a 16-terminal BIPOLAR logic IC with CERAMIC package. It operates b/w 0-70°C, ideal for COMMERCIAL applications. The RECTANGULAR IN-LINE package style with DUAL terminals and 2.54mm pitch makes it suitable for various Other Function Logic ICs uses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,354

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-

-

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Digiode

USA . 2,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,407

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,660 parts In-Stock

1+ parts

$8.224

100+ parts

-

1k+ parts

$8.837

10k+ parts

-

1,660

$8.224

-

$8.837

-

DigiPath Technology Company

USA . 813 parts In-Stock

1+ parts

$9.055

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$9.055

-

-

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ChromeModa Solutions

Germany . 1,048 parts In-Stock

1+ parts

$9.240

100+ parts

$7.577

1k+ parts

-

10k+ parts

-

1,048

$9.240

$7.577

-

-

IDEA Electronic Components Group

UK . 853 parts In-Stock

1+ parts

$9.240

100+ parts

$8.778

1k+ parts

$8.316

10k+ parts

-

853

$9.240

$8.778

$8.316

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AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$19.676

100+ parts

-

1k+ parts

-

10k+ parts

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850

$19.676

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One Stop Electronics

USA . 321 parts In-Stock

1+ parts

$54.000

100+ parts

-

1k+ parts

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10k+ parts

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321

$54.000

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Corphita

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

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2,182

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Overview

Unleash the power of cutting-edge technology with the SN75324JP4 by Texas Instruments, a top-tier manufacturer renowned for its superior quality. This versatile logic IC belongs to the Other Function category and boasts a ceramic package body material with 16 terminals in a sleek rectangular shape. Whether you're looking to enhance your industrial automation systems or streamline your consumer electronics, this product offers unbeatable value, reliability, and performance. Elevate your projects to new heights with the SN75324JP4 and experience the Texas Instruments advantage today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and resistance to high temperatures, making it suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment on circuit boards, maximizing space efficiency.

No. of Terminals: 16

With 16 terminals, this product can accommodate a wide range of connections and interfaces, making it versatile for various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style offers a compact design that is suitable for applications where space is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and stability even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases connection reliability, reducing the risk of signal loss or failure.

Temperature Grade: COMMERCIAL

Commercial temperature grade allows this product to be used in standard commercial applications, providing a cost-effective solution.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and low power consumption, making this product ideal for applications that require quick response times and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections, ensuring stable performance over time.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is compatible with a wide range of standard socket connectors, facilitating easy integration into existing systems.

Technical Specifications

Other Function Logic ICs SN75324JP4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75324JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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