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CD4048BPWRG4

Texas Instruments

CD4048BPWRG4 by Texas Instruments

CD4048BPWRG4 by Texas Instruments is a CMOS logic IC with 600ns propagation delay at 5V. It has 16 terminals, operates b/w -55 to 125 °C, and supports a load capacitance of 50pF. Ideal for military applications due to its small outline package and three-state output characteristics.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 8,681 parts In-Stock

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Digiode

USA . 4,596 parts In-Stock

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Native Components

USA . 805 parts In-Stock

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$0.794

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Northwest PG Solutions

USA . 497 parts In-Stock

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$0.873

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One Stop Electronics

USA . 1,470 parts In-Stock

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AZTECH Wire

Italy . 549 parts In-Stock

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Parana Technologies

USA . 95 parts In-Stock

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$22.879

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DigiPath Technology Company

USA . 2,148 parts In-Stock

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$27.992

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$25.752

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ChromeModa Solutions

Germany . 5,890 parts In-Stock

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IDEA Electronic Components Group

UK . 2,340 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience top-notch quality and reliability with the CD4048BPWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional products like this Other Function Logic ICs, designed for a wide range of applications. With a nominal supply voltage of 5V and maximum operating temperature of 125°C, this product offers outstanding performance and durability. Trust in Texas Instruments to provide innovative solutions that bring value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 600 ns

Fast propagation delay allows for efficient data processing and quick response times.

Surface Mount: YES

Surface mount option enables easy installation and space-saving design.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes it compatible with many systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable and efficient performance.

Power Supplies (V): 5/15

Versatile power supply options provide flexibility in different applications.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving package style suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environments.

Output Characteristics: 3-STATE

3-state output allows for high impedance state when not driving a signal, increasing flexibility in circuit design.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures makes it suitable for both extreme cold and hot conditions.

Terminal Position: DUAL

Dual terminal position provides stability and secure connection.

Maximum Seated Height: 1.2 mm

Low seated height for compact and slim design requirements.

Width: 4.4 mm

Narrow width for space-saving installation.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage allows for efficient power consumption.

Length: 5 mm

Short length for compact and efficient circuit design.

Temperature Grade: MILITARY

Military-grade temperature tolerance for rugged and demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable connection.

Packing Method: TR

TR packing method provides convenience in storage and handling.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and space-saving design.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage for versatility in power supply options.

Technical Specifications

Other Function Logic ICs CD4048BPWRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD4048BPWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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