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SN74LVC1G57DBVRE4

Texas Instruments

SN74LVC1G57DBVRE4 by Texas Instruments

SN74LVC1G57DBVRE4 by Texas Instruments is a CMOS logic IC with 6.3ns propagation delay, 50pF load capacitance, and 1.8V nominal voltage. It is used in industrial applications for its Schmitt Trigger feature, 3-STATE output characteristics, and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,969 parts In-Stock

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3,969

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Vyrian

USA . 2,413 parts In-Stock

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2,413

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Distributors (Availability)

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$8.732

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696

$8.732

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Parana Technologies

USA . 1,013 parts In-Stock

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$24.002

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-

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$24.656

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1,013

$24.002

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$24.656

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DigiPath Technology Company

USA . 1,826 parts In-Stock

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$26.429

100+ parts

$24.314

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1,826

$26.429

$24.314

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ChromeModa Solutions

Germany . 2,934 parts In-Stock

1+ parts

$26.968

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$22.114

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2,934

$26.968

$22.114

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IDEA Electronic Components Group

UK . 595 parts In-Stock

1+ parts

$26.968

100+ parts

$25.620

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$24.271

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595

$26.968

$25.620

$24.271

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One Stop Electronics

USA . 614 parts In-Stock

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$53.000

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614

$53.000

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iodParts Technologies Inc.

India . 3,235 parts In-Stock

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Corphita

USA . 453 parts In-Stock

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453

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Overview

Discover the versatility and reliability of the SN74LVC1G57DBVRE4 by Texas Instruments, a top-quality Other Function Logic IC that promises seamless performance in various applications. With a focus on innovation and precision engineering, Texas Instruments delivers unmatched value to customers seeking cutting-edge solutions. This product boasts a compact design and low power consumption, making it ideal for space-constrained projects where efficiency is key. Trust Texas Instruments to provide you with the tools you need to elevate your designs and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ICs, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay allows for quick signal processing, making the product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup: 1.8V

Low nominal supply voltage helps minimize power consumption, making the product energy-efficient.

Output Characteristics: 3-STATE

3-state output allows for multiple logical levels, enhancing flexibility in circuit design and functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh operating conditions, making the product suitable for industrial applications.

Schmitt Trigger: YES

Schmitt trigger input helps eliminate noise and signal distortion, improving the overall reliability of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product ideal for battery-powered devices and noise-sensitive applications.

Technical Specifications

Other Function Logic ICs SN74LVC1G57DBVRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G57DBVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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