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74LVC1G57GM,115

NXP Semiconductors

74LVC1G57GM,115 by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GM,115 is a CMOS logic IC with 7.9ns propagation delay at 1.8V supply voltage. It features Schmitt Trigger and operates in automotive temperature grade range (-40 to 125 °C). This small outline package with dual terminals is ideal for applications requiring fast signal processing in automotive electronics.

Median Price

$0.176

Lifecycle Status

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16

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1k+

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Chip1Stop

Japan . 1,940 parts In-Stock

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$0.189

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Mouser Electronics

USA . 12,719 parts In-Stock

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$0.089

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$0.080

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$0.076

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$0.076

DigiKey

USA . 4,900 parts In-Stock

1+ parts

$0.190

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$0.096

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$0.079

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$0.063

4,900

$0.190

$0.096

$0.079

$0.063

Rochester

USA . 10,187 parts In-Stock

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$0.164

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Avnet

USA . 5,000 parts In-Stock

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Arrow

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Verical

USA . 5,000 parts In-Stock

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Digiode

USA . 64 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Chip Stock

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DigiKey Marketplace

USA . 10,187 parts In-Stock

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NAC Semi

USA . 10,000 parts In-Stock

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IBS Electronics

USA . 10,000 parts In-Stock

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Vyrian

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Anansix

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VNN

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Corphita

USA . 285 parts In-Stock

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$0.056

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AZTECH Wire

Italy . 11,852 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 4,588 parts In-Stock

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Argo Parts USA

USA . 3,936 parts In-Stock

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Ampacity Inc.

Singapore . 8,573 parts In-Stock

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Microchip USA

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Aztec Data Supply Inc.

USA . 4,593 parts In-Stock

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Corohmni

South Africa . 42 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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iodParts Technologies Inc.

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Supply Digital

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Overview

Discover the cutting-edge 74LVC1G57GM,115 from NXP Semiconductors, a leading manufacturer in the industry. This versatile Other Function Logic IC offers unparalleled quality and reliability in a compact package, making it ideal for a wide range of applications. With a low propagation delay, high-speed performance, and Schmitt Trigger technology, this innovative product ensures smooth operation and precise results. Trust NXP Semiconductors to deliver exceptional value and benefits with the 74LVC1G57GM,115, providing customers with a competitive edge in their projects. Elevate your designs with this top-of-the-line solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a long-lasting choice.

Propagation Delay At Nominal Supply: 7.9 ns

With a fast propagation delay, this IC ensures efficient signal processing.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

The rectangular shape provides easy integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage makes this IC energy-efficient.

Load Capacitance (CL): 50 pF

The low load capacitance ensures stable performance in different applications.

Power Supplies (V): 3.3

With multiple power supplies, this IC can adapt to different voltage requirements.

No. of Terminals: 6

Having six terminals allows for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small profile and thin package style save space in compact designs.

Maximum I (ol): 24 Amp

With high output current capability, this IC can drive larger loads.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes this IC suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures ensures reliability in extreme conditions.

Terminal Finish: Tin (Sn)

The tin terminal finish offers corrosion resistance and longevity.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board layouts.

Maximum Seated Height: 0.5 mm

The low seated height allows for a slim and compact design.

Width: 1 mm

With a narrow width, this IC can be used in space-constrained applications.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage ensures compatibility with various systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable soldering during assembly.

Length: 1.45 mm

The compact length of this IC saves space in electronic circuits.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability in harsh automotive environments.

Schmitt Trigger: YES

The built-in Schmitt trigger enhances noise immunity and signal stability.

Technology: CMOS

Operating on CMOS technology ensures low power consumption and high performance.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with regulations.

Packing Method: TR

This Tape and Reel packing method facilitates automated assembly processes.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this IC offers high-density mounting capabilities.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a wide supply voltage range allows for compatibility with various systems.

Technical Specifications

Other Function Logic ICs 74LVC1G57GM,115 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G57GM,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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