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HMC720LC3

Analog Devices

HMC720LC3 by Analog Devices

Analog Devices' HMC720LC3 is a ceramic, metal-sealed co-fired chip carrier with 16 terminals. Operating from -40 to 85 °C, it has a power supply of -3.3V and terminal finish of gold over nickel. Ideal for industrial applications requiring very thin profile logic ICs in a square package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,455 parts In-Stock

1+ parts

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3,455

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Digiode

USA . 839 parts In-Stock

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839

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$19.361

100+ parts

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330

$19.361

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Semicontronic

India . 908 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

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908

$20.000

$19.500

$19.400

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Parana Technologies

USA . 1,531 parts In-Stock

1+ parts

$26.002

100+ parts

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$24.182

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1,531

$26.002

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$24.182

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IDEA Electronic Components Group

UK . 975 parts In-Stock

1+ parts

$27.959

100+ parts

$26.561

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975

$27.959

$26.561

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DigiPath Technology Company

USA . 1,742 parts In-Stock

1+ parts

$43.616

100+ parts

$41.871

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$41.871

1,742

$43.616

$41.871

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$41.871

One Stop Electronics

USA . 1,518 parts In-Stock

1+ parts

$52.000

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1,518

$52.000

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Corphita

USA . 72 parts In-Stock

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72

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Overview

Discover the power of precision with the HMC720LC3 by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality products that exceed expectations. The HMC720LC3, part of the Other Function Logic ICs category, offers unparalleled performance and reliability for a wide range of applications. With its innovative design and advanced features, this chip carrier provides customers with unmatched value and benefits. Experience the advantages of Analog Devices technology with the HMC720LC3 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high reliability and durability, making the product suitable for industrial applications.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Power Supplies (V): -3.3

Low power consumption for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for a wide range of operating environments.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring consistent performance.

Technical Specifications

Other Function Logic ICs HMC720LC3 attributes and parameters. Explore more Other Function Logic ICs devices from Analog Devices

Specs

Family:

720

JESD-30 Code:

S-CQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

-3.3

Qualification:

Not Qualified

Maximum Seated Height:

.92 mm

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC720LC3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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