Loading...

SN74AUP1G57DRLRG4

Texas Instruments

SN74AUP1G57DRLRG4 by Texas Instruments

SN74AUP1G57DRLRG4 by Texas Instruments is a CMOS logic IC with 26.5 ns propagation delay, 30 pF load capacitance, and 3-STATE output characteristics. It operates at a nominal voltage of 1.2V and is ideal for industrial applications requiring Schmitt Trigger functionality in a small outline package with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,340

-

-

-

-

Vyrian

USA . 3,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,564

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$8.828

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$8.828

-

-

-

Parana Technologies

USA . 1,124 parts In-Stock

1+ parts

$11.074

100+ parts

-

1k+ parts

$11.534

10k+ parts

-

1,124

$11.074

-

$11.534

-

DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$12.194

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

$12.194

-

-

-

IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$12.443

100+ parts

$11.821

1k+ parts

$11.199

10k+ parts

-

1,720

$12.443

$11.821

$11.199

-

ChromeModa Solutions

Germany . 769 parts In-Stock

1+ parts

$12.443

100+ parts

$10.203

1k+ parts

-

10k+ parts

-

769

$12.443

$10.203

-

-

One Stop Electronics

USA . 1,607 parts In-Stock

1+ parts

$55.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,607

$55.000

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,042

-

-

-

-

Corphita

USA . 2,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,991

-

-

-

-

Microchip USA

USA . 2,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,462

-

-

-

-

Overview

Unlock the potential of your electronic designs with the SN74AUP1G57DRLRG4 by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments delivers top-quality logic ICs like the SN74AUP1G57DRLRG4, known for its reliability and precision. This versatile component is ideal for a wide range of applications, offering high performance and efficiency. With a low propagation delay and a wide supply voltage range, this IC provides exceptional value and flexibility for your projects. Trust Texas Instruments to bring innovation and excellence to your designs with the SN74AUP1G57DRLRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the IC, making it suitable for various environments.

Propagation Delay At Nominal Supply: 26.5 ns

Fast propagation delay ensures quick response time and efficient performance of the logic IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving space and facilitating manufacturing processes.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low nominal voltage, making it energy-efficient and suitable for battery-operated devices.

Load Capacitance (CL): 30 pF

Suitable for driving a load capacitance of up to 30 pF, providing flexibility in design and compatibility with various circuit configurations.

Power Supplies (V): 1.2/3.3

Supports multiple power supply voltages, offering versatility in system integration and compatibility with different voltage requirements.

No. of Terminals: 6

A sufficient number of terminals for connectivity, allowing for proper interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and thin package style saves space on the PCB, ideal for applications where size constraints are critical.

Maximum I (ol): 4 Amp

High output current capability ensures reliable and robust performance, suitable for driving heavy loads.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable operation in various environmental conditions, including industrial settings.

Output Characteristics: 3-STATE

3-state output capability provides additional flexibility in controlling the output signal, enabling more complex logic functions to be implemented.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes it suitable for use in harsh environments or applications that require extended temperature ranges.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

High-quality terminal finish ensures reliable electrical connections and corrosion resistance, extending the lifespan of the IC.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and enables easy integration into different PCB designs.

Maximum Seated Height: 0.6 mm

Low profile design enables the IC to be used in space-constrained applications without compromising on performance.

Width: 1.2 mm

Compact width dimension saves space on the PCB, contributing to efficient board layout and design.

Output Polarity: TRUE

True output polarity ensures compatibility with other components and simplifies signal processing in the circuit.

Minimum Supply Voltage (Vsup): 0.8 V

Low minimum supply voltage requirement allows for operation in battery-powered devices or low-power applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering processes, ensuring reliable assembly and manufacturing.

Length: 1.6 mm

Compact length dimension contributes to the overall small form factor of the IC, suitable for miniaturized applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments with varying temperature conditions.

Schmitt Trigger: YES

Schmitt trigger functionality provides hysteresis and noise immunity, enhancing signal integrity and robustness in digital communication.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making it suitable for various applications.

Terminal Form: FLAT

Flat terminal form facilitates easy soldering and reliable electrical connections, enhancing the overall performance and durability of the IC.

Packing Method: TR

Tape and reel packing method ensures convenient handling, storage, and automated assembly of the IC, enhancing manufacturing efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling compact and space-saving circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage capability provides flexibility in power supply options and compatibility with a wide range of voltage sources.

Technical Specifications

Other Function Logic ICs SN74AUP1G57DRLRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

SN74AUP1G57DRLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20