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SNJ54LS326J-00

Texas Instruments

SNJ54LS326J-00 by Texas Instruments

SNJ54LS326J-00 by Texas Instruments is a TTL logic IC with 2 functions, operating at -55 to 125°C. It has 16 terminals, MILITARY grade, and a supply voltage range of 4.5V to 5.5V. This rectangular package is ideal for applications requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,529 parts In-Stock

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2,529

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Digiode

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$10.261

100+ parts

-

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279

$10.261

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One Stop Electronics

USA . 1,129 parts In-Stock

1+ parts

$12.000

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-

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1,129

$12.000

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Parana Technologies

USA . 1,013 parts In-Stock

1+ parts

$17.555

100+ parts

$1,630.271

1k+ parts

$15.800

10k+ parts

-

1,013

$17.555

$1,630.271

$15.800

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DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$19.330

100+ parts

$17.784

1k+ parts

-

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1,040

$19.330

$17.784

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ChromeModa Solutions

Germany . 3,164 parts In-Stock

1+ parts

$19.725

100+ parts

$16.174

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3,164

$19.725

$16.174

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IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$19.725

100+ parts

$18.739

1k+ parts

$17.752

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111

$19.725

$18.739

$17.752

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Corphita

USA . 1,105 parts In-Stock

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1,105

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Overview

Elevate your electronic projects with the SNJ54LS326J-00 by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. As part of the Other Function Logic ICs category, this product offers unparalleled reliability and performance in a variety of applications. With a MILITARY temperature grade and dual terminal position, this IC is designed to withstand harsh environments while delivering consistent results. Trust Texas Instruments to provide cutting-edge technology and superior functionality with the SNJ54LS326J-00, ensuring that your projects operate at peak efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and resistance to environmental factors, making the product reliable for various applications.

No. of Functions: 2

Having multiple functions in one IC saves space on the circuit board and can potentially reduce component count, simplifying the design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard TTL logic levels, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to function reliably in harsh environments without overheating or performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the IC can also operate in extreme cold conditions, expanding its range of applications.

Technology: TTL

Being based on TTL technology, the IC offers robust and reliable logic operations, making it a popular choice for digital circuit design.

Technical Specifications

Other Function Logic ICs SNJ54LS326J-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SNJ54LS326J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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