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SNJ54LS324J-00

Texas Instruments

SNJ54LS324J-00 by Texas Instruments

SNJ54LS324J-00 by Texas Instruments is a TTL logic IC with 14 terminals, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and is MILITARY grade suitable for various applications requiring Other Function Logic ICs in CERAMIC package material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,452 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,452

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Digiode

USA . 4,494 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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4,494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$17.052

100+ parts

-

1k+ parts

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10k+ parts

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665

$17.052

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Parana Technologies

USA . 1,061 parts In-Stock

1+ parts

$17.088

100+ parts

-

1k+ parts

$17.303

10k+ parts

-

1,061

$17.088

-

$17.303

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ChromeModa Solutions

Germany . 1,039 parts In-Stock

1+ parts

$19.200

100+ parts

$15.744

1k+ parts

-

10k+ parts

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1,039

$19.200

$15.744

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$19.200

100+ parts

$18.240

1k+ parts

$17.280

10k+ parts

-

384

$19.200

$18.240

$17.280

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One Stop Electronics

USA . 846 parts In-Stock

1+ parts

$55.000

100+ parts

-

1k+ parts

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846

$55.000

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Corphita

USA . 3,528 parts In-Stock

1+ parts

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3,528

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

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100+ parts

$17.311

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1,522

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$17.311

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Overview

Upgrade your electronics with the SNJ54LS324J-00 by Texas Instruments. Known for their high-quality products, Texas Instruments has designed this Other Function Logic IC to deliver reliable performance in a variety of applications. With a military-grade temperature range and a sturdy ceramic, glass-sealed package, this IC ensures durability and precision. Trust in Texas Instruments to provide cutting-edge technology that meets your needs. Elevate your projects with the SNJ54LS324J-00 today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials make the package durable and reliable, ensuring long-term functionality.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V allows for easy compatibility with standard power sources and ensures stable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions without compromising functionality.

Technology: TTL

The use of TTL technology ensures fast response times and efficient logic operations, making this product suitable for applications requiring high-speed processing.

Technical Specifications

Other Function Logic ICs SNJ54LS324J-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T14

Logic IC Type:

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SNJ54LS324J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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