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SN74ALS6310ADW

Texas Instruments

SN74ALS6310ADW by Texas Instruments

SN74ALS6310ADW by Texas Instruments is a TTL technology logic IC with 20 terminals, operating at 5V. It has a rectangular package shape and can withstand temperatures from 0 to 70°C. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,906 parts In-Stock

1+ parts

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8,906

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Digiode

USA . 1,308 parts In-Stock

1+ parts

-

100+ parts

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1,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$6.197

100+ parts

-

1k+ parts

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10k+ parts

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869

$6.197

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Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

$14.094

100+ parts

-

1k+ parts

$14.558

10k+ parts

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1,339

$14.094

-

$14.558

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DigiPath Technology Company

USA . 1,891 parts In-Stock

1+ parts

$15.519

100+ parts

$14.278

1k+ parts

-

10k+ parts

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1,891

$15.519

$14.278

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ChromeModa Solutions

Germany . 4,482 parts In-Stock

1+ parts

$15.836

100+ parts

$12.986

1k+ parts

-

10k+ parts

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4,482

$15.836

$12.986

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IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$15.836

100+ parts

$15.044

1k+ parts

$14.252

10k+ parts

-

1,345

$15.836

$15.044

$14.252

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One Stop Electronics

USA . 1,247 parts In-Stock

1+ parts

$23.000

100+ parts

-

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1,247

$23.000

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Corphita

USA . 3,354 parts In-Stock

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3,354

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Overview

Unlock the potential of your electronic projects with the SN74ALS6310ADW by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable and durable products that exceed industry standards. This Other Function Logic IC offers versatile applications in various electronic devices, providing customers with the value and performance they need. Whether you're a hobbyist or a professional, the SN74ALS6310ADW is the perfect choice to elevate your projects to the next level. Trust Texas Instruments for cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring long-term reliability and performance.

Surface Mount: YES

Being surface mountable makes the IC suitable for automated assembly processes, saving time and cost in production.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 70 °C

Capable of operating at high temperatures without degradation, suitable for demanding environments.

Technology: TTL

TTL technology offers high speed and reliable logic operations, making it ideal for various digital applications.

Technical Specifications

Other Function Logic ICs SN74ALS6310ADW attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS6310ADW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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