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SN74AUP1G58YZTR

Texas Instruments

SN74AUP1G58YZTR by Texas Instruments

SN74AUP1G58YZTR by Texas Instruments features a propagation delay of 26.6ns, operates at a supply voltage of 1.2V/3.3V, and has a max I (ol) of 1.7Amp. This CMOS technology IC with Schmitt Trigger is ideal for industrial applications requiring 3-STATE output characteristics in a compact GRID ARRAY package style.

Median Price

$0.184

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

$0.199

1k+ parts

$0.165

10k+ parts

$0.147

81,000

-

$0.199

$0.165

$0.147

DigiKey

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.170

81,000

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$0.170

Verical

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$0.184

81,000

-

-

-

$0.184

Distributors (In-Stock)

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Digiode

USA . 1,121 parts In-Stock

1+ parts

$0.155

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1,121

$0.155

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Vyrian

USA . 3,567 parts In-Stock

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$0.163

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3,567

$0.163

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DigiKey Marketplace

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.170

10k+ parts

-

81,000

-

-

$0.170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,792 parts In-Stock

1+ parts

$0.147

100+ parts

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2,792

$0.147

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Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

$19.258

100+ parts

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1k+ parts

$19.290

10k+ parts

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1,569

$19.258

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$19.290

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

$21.205

100+ parts

$19.509

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1,401

$21.205

$19.509

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ChromeModa Solutions

Germany . 2,750 parts In-Stock

1+ parts

$21.638

100+ parts

$17.743

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2,750

$21.638

$17.743

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IDEA Electronic Components Group

UK . 734 parts In-Stock

1+ parts

$21.638

100+ parts

$20.556

1k+ parts

$19.474

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734

$21.638

$20.556

$19.474

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Kepictronics

USA . 3,000 parts In-Stock

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Microchip USA

USA . 460 parts In-Stock

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460

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Overview

Discover the cutting-edge SN74AUP1G58YZTR by Texas Instruments, a top-tier manufacturer known for its high-quality products. This versatile logic IC falls under the category of Other Function Logic ICs, offering a nominal supply voltage of 1.2V and a propagation delay of 26.6 ns. With a sleek rectangular package shape and surface-mount design, this component is ideal for a wide range of applications. Experience the value and benefits of this product with its impressive features, such as 3-STATE output characteristics and Schmitt Trigger technology. Upgrade your projects with the SN74AUP1G58YZTR and unlock endless possibilities in industrial-grade applications.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 26.6 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation on PCBs, saving space and reducing overall product size.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low nominal supply voltage of 1.2V, making it energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable performance even in harsh environmental conditions.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Technical Specifications

Other Function Logic ICs SN74AUP1G58YZTR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1.4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.625 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.9 mm

Trade Compliance

SN74AUP1G58YZTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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