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SN74AUP1G99DCUT

Texas Instruments

SN74AUP1G99DCUT by Texas Instruments

SN74AUP1G99DCUT by Texas Instruments is a CMOS logic IC with 36.1ns propagation delay, 30pF load capacitance, and 4A max I (ol). It is used in industrial applications, featuring a true output polarity and Schmitt trigger for precise signal processing in a compact package style.

Median Price

$0.680

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 131,500 parts In-Stock

1+ parts

$0.756

100+ parts

$0.581

1k+ parts

$0.306

10k+ parts

-

131,500

$0.756

$0.581

$0.306

-

Mouser Electronics

USA . 235 parts In-Stock

1+ parts

$0.960

100+ parts

$0.550

1k+ parts

$0.463

10k+ parts

$0.441

235

$0.960

$0.550

$0.463

$0.441

Rochester

USA . 86,563 parts In-Stock

1+ parts

-

100+ parts

$0.547

1k+ parts

$0.454

10k+ parts

$0.405

86,563

-

$0.547

$0.454

$0.405

DigiKey

USA . 86,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.680

10k+ parts

-

86,563

-

-

$0.680

-

Verical

USA . 64,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.567

10k+ parts

$0.506

64,645

-

-

$0.567

$0.506

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,043 parts In-Stock

1+ parts

$0.404

100+ parts

-

1k+ parts

-

10k+ parts

-

1,043

$0.404

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.433

-

-

-

Vyrian

USA . 69,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,685

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 69,678 parts In-Stock

1+ parts

$0.361

100+ parts

-

1k+ parts

-

10k+ parts

-

69,678

$0.361

-

-

-

Corphita

USA . 151 parts In-Stock

1+ parts

$0.382

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$0.382

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

$0.411

10k+ parts

$0.402

100

$0.433

-

$0.411

$0.402

Parana Technologies

USA . 1,944 parts In-Stock

1+ parts

$29.228

100+ parts

-

1k+ parts

$57.024

10k+ parts

-

1,944

$29.228

-

$57.024

-

DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$32.183

100+ parts

$29.609

1k+ parts

-

10k+ parts

-

798

$32.183

$29.609

-

-

ChromeModa Solutions

Germany . 2,054 parts In-Stock

1+ parts

$32.840

100+ parts

$26.929

1k+ parts

-

10k+ parts

-

2,054

$32.840

$26.929

-

-

IDEA Electronic Components Group

UK . 127 parts In-Stock

1+ parts

$32.840

100+ parts

$31.198

1k+ parts

$29.556

10k+ parts

-

127

$32.840

$31.198

$29.556

-

Overview

Boost your electronics projects with the SN74AUP1G99DCUT by Texas Instruments. This high-quality logic IC offers unmatched reliability and performance, making it perfect for a wide range of applications. From consumer electronics to industrial automation, this versatile component delivers value and efficiency. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the SN74AUP1G99DCUT and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material of the package body ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 36.1 ns

Low propagation delay ensures fast and efficient operation of the logic IC.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage: 1.1 V

Low nominal supply voltage reduces power consumption and heat generation.

Load Capacitance (CL): 30 pF

Suitable load capacitance for stable and precise signal transmission.

Output Characteristics: 3-STATE

3-STATE output characteristics offer flexibility in controlling the output signal.

Technology: CMOS

CMOS technology provides high noise immunity and low power consumption.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in harsh environmental conditions.

Maximum Operating Temperature: 85 °C

Operating temperature up to 85 °C allows for usage in industrial environments.

Terminal Finish: Matte Tin (Sn)

Matte Tin finish on terminals offers good solderability and corrosion resistance.

Technical Specifications

Other Function Logic ICs SN74AUP1G99DCUT attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN74AUP1G99DCUT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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