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HCF4048BEY

STMicroelectronics

HCF4048BEY by STMicroelectronics

HCF4048BEY by STMicroelectronics is a CMOS logic IC with 16 terminals and 3-STATE output. It operates b/w -55 to 125 °C, with a propagation delay of 600 ns at 5V. Suitable for military applications due to its MILITARY temperature grade and PLASTIC/EPOXY package material.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,084 parts In-Stock

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Digiode

USA . 997 parts In-Stock

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Anansix

USA . 97 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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Semicontronic

India . 620 parts In-Stock

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$8.000

100+ parts

$7.800

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$7.760

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620

$8.000

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$7.760

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AZTECH Wire

Italy . 313 parts In-Stock

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$10.771

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Aztec Data Supply Inc.

USA . 715 parts In-Stock

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$11.040

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$11.040

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Corohmni

South Africa . 302 parts In-Stock

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$24.060

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IDEA Electronic Components Group

UK . 77 parts In-Stock

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$26.680

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$24.012

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$38.560

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$35.090

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$31.619

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MKK Technologies

India . 862 parts In-Stock

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$50.170

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DigiPath Technology Company

USA . 862 parts In-Stock

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Ampacity Inc.

Singapore . 1,217 parts In-Stock

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Argo Parts USA

USA . 4,484 parts In-Stock

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Corphita

USA . 2,510 parts In-Stock

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Continental Prestige Electronics

USA . 559 parts In-Stock

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Parana Technologies

USA . 149 parts In-Stock

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$31.900

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the HCF4048BEY by STMicroelectronics, a top-quality Other Function Logic IC that offers superior performance and reliability. With a 600 ns propagation delay and 3-STATE output characteristics, this innovative product is perfect for a wide range of applications. STMicroelectronics, known for its cutting-edge technology and commitment to excellence, ensures that this IC delivers unmatched value and benefits to customers. Trust in the HCF4048BEY for all your logic IC needs and experience the difference that quality and precision can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 600 ns

The low propagation delay of 600 ns at nominal supply voltage allows for fast signal processing and improved performance.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for the product to operate efficiently.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures minimal signal distortion and improved signal integrity.

Power Supplies (V): 5/15

The product supports dual power supplies of 5V and 15V, providing flexibility in powering options for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh environmental conditions without compromising performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance output state, which is useful in bus-oriented systems for reducing power consumption.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-powered devices and sensitive applications.

Technical Specifications

Other Function Logic ICs HCF4048BEY attributes and parameters. Explore more Other Function Logic ICs devices from STMicroelectronics

Specs

Additional Features:

CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4048BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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