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NLX1G58BMX1TCG

Onsemi

NLX1G58BMX1TCG by Onsemi

NLX1G58BMX1TCG by Onsemi is a small outline, very thin profile logic IC with 6 terminals. It operates b/w -55 to 125 °C and supports supply voltage from 1.65V to 5.5V. Ideal for military-grade applications requiring compact design and high-temperature tolerance.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 159,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

159,000

-

$0.092

$0.077

$0.068

DigiKey

USA . 159,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.080

159,000

-

-

-

$0.080

Verical

USA . 111,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.086

111,000

-

-

-

$0.086

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 311 parts In-Stock

1+ parts

$0.063

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$0.063

-

-

-

Digiode

USA . 1,220 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$0.072

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 180 parts In-Stock

1+ parts

$0.063

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$0.063

-

-

-

Corphita

USA . 2,092 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

10k+ parts

-

2,092

$0.068

-

-

-

Vigor

Singapore . 196 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$0.070

-

-

-

Component Stockers USA

USA . 170,781 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

$0.070

170,781

$0.080

$0.070

$0.070

$0.070

Continental Prestige Electronics

USA . 159,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.066

10k+ parts

-

159,000

-

-

$0.066

-

Authorized Procurement Solutions

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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40,000

-

-

-

-

Kulean Microsystems

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,680

-

-

-

-

TANS Electronics

Latvia . 4,634 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,634

-

-

-

-

SupplyDigital Components

Austria . 2,021 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,021

-

-

-

-

Problanco Electronics

Mexico . 1,256 parts In-Stock

1+ parts

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100+ parts

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1,256

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Microchip USA

USA . 351 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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351

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UHIMA Technologies

Türkiye . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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155

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Onsemi with the NLX1G58BMX1TCG, a top-of-the-line Other Function Logic IC. This surface mount device offers exceptional performance in a small outline, very thin profile package, making it ideal for a wide range of applications. From military-grade precision to everyday functionality, this product delivers value, benefits, and advantages that will elevate your projects to new heights. Trust Onsemi's expertise and innovation to take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes it easy to integrate this logic IC into a printed circuit board, allowing for a more compact and efficient design.

Nominal Supply Voltage / Vsup (V): 2.3

With a nominal supply voltage of 2.3V, this logic IC can operate efficiently with a moderate power consumption, making it suitable for various low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this logic IC can withstand higher temperature environments, ensuring reliable performance in a wide range of conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C makes this logic IC suitable for use in extreme cold environments, providing versatility in application usage.

Width: 1 mm

The compact width of 1mm allows for space-saving integration of this logic IC in tight layouts, enabling efficient use of board space in electronic designs.

Technical Specifications

Other Function Logic ICs NLX1G58BMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G58BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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