Loading...

NLX1G58BMUTCG

Onsemi

NLX1G58BMUTCG by Onsemi

NLX1G58BMUTCG by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and comes in a small outline package suitable for military-grade applications. This surface-mount IC is ideal for compact electronic devices requiring high reliability in extreme temperature conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,289

-

-

-

-

Vyrian

USA . 795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

795

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,550

-

-

-

-

TANS Electronics

Latvia . 5,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,572

-

-

-

-

Problanco Electronics

Mexico . 4,127 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,127

-

-

-

-

Corphita

USA . 1,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,910

-

-

-

-

SupplyDigital Components

Austria . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,851

-

-

-

-

Corohmni

South Africa . 424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

424

-

-

-

-

UHIMA Technologies

Türkiye . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Overview

Elevate your electronic projects with the NLX1G58BMUTCG by Onsemi. Crafted with precision and expertise, this small outline, very thin profile logic IC offers unparalleled quality and reliability. From military-grade technology to a wide temperature range, this product is designed to excel in various applications. Whether you're working on automotive systems or consumer electronics, this IC guarantees optimal performance and efficiency. Trust Onsemi to deliver cutting-edge solutions that exceed expectations. Elevate your designs with the NLX1G58BMUTCG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and facilitates easy placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with many electronic systems.

No. of Terminals: 6

Having 6 terminals allows for more connections and functionalities, making the product versatile in its applications.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile design save space on the PCB and enhance overall system compactness.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to operate in cold environments without malfunctioning.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connections, allowing for various configurations.

Maximum Seated Height: 0.55 mm

Low maximum seated height helps in maintaining a slim profile and compact size of the product.

Width: 1 mm

Narrow width makes the product suitable for space-constrained applications where board real estate is limited.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage enables the product to operate efficiently in low-power applications.

Length: 1.2 mm

Short length contributes to the product's small form factor and enhances its suitability for compact designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product's reliability and performance under extreme operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making the product eco-friendly.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for compact layout and high-density mounting on the PCB, optimizing space usage.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage rating provides flexibility in operating the product in various voltage environments without damage.

Technical Specifications

Other Function Logic ICs NLX1G58BMUTCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

Length:

1.2 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G58BMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19