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SN74ALS2442FN

Texas Instruments

SN74ALS2442FN by Texas Instruments

SN74ALS2442FN by Texas Instruments is a TTL logic IC with 20 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.75-5.25V and comes in a square chip carrier package. Ideal for commercial applications requiring high-speed signal processing in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,015 parts In-Stock

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5,015

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Digiode

USA . 859 parts In-Stock

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859

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Prism Electronics

USA . 47 parts In-Stock

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47

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Electro Mavin

USA . 4 parts In-Stock

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AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$7.344

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393

$7.344

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Parana Technologies

USA . 2,335 parts In-Stock

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$26.472

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$27.052

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2,335

$26.472

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DigiPath Technology Company

USA . 413 parts In-Stock

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$29.149

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$26.817

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413

$29.149

$26.817

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ChromeModa Solutions

Germany . 5,415 parts In-Stock

1+ parts

$29.744

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$24.390

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5,415

$29.744

$24.390

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IDEA Electronic Components Group

UK . 1,248 parts In-Stock

1+ parts

$29.744

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$28.257

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$26.770

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$29.744

$28.257

$26.770

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One Stop Electronics

USA . 1,595 parts In-Stock

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$33.000

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1,595

$33.000

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Corphita

USA . 118 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of reliable logic operations with the SN74ALS2442FN by Texas Instruments. Manufactured with precision and quality, this IC offers versatile applications in various electronic circuits. From automotive to industrial automation, this chip provides efficient performance and seamless integration. With a compact square package and a wide temperature range, customers can trust in the durability and stability of this product. Experience the value and benefits of Texas Instruments' superior technology with the SN74ALS2442FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and improving overall circuit design.

Package Shape: SQUARE

Square shape makes it easy to handle and place on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with most systems and devices.

No. of Terminals: 20

Provides ample connectivity options for integration into various circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures without degradation in performance.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without any issues.

Terminal Position: QUAD

Quad terminal position provides stable electrical connections and facilitates easy soldering.

Minimum Supply Voltage (Vsup): 4.75 V

Tolerant to slight variations in supply voltage, ensuring stable operation.

Temperature Grade: COMMERCIAL

Suitable for use in commercial applications with typical temperature ranges.

Technology: TTL

TTL technology offers fast switching speeds and is widely used in digital systems.

Terminal Form: J BEND

J bend terminals provide secure connections and ease of PCB mounting.

Maximum Supply Voltage (Vsup): 5.25 V

Withstands slight overvoltage conditions, enhancing the reliability of the IC.

Technical Specifications

Other Function Logic ICs SN74ALS2442FN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS2442FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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