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NLX1G97CMUTCG

Onsemi

NLX1G97CMUTCG by Onsemi

NLX1G97CMUTCG by Onsemi is a CMOS Schmitt Trigger IC with 14.4ns propagation delay at 5V, suitable for military applications. It operates b/w -55 to 125 °C and has a load capacitance of 30pF. This small outline, low-profile IC features dual terminals and can handle up to 8A current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 815 parts In-Stock

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Digiode

USA . 182 parts In-Stock

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Kulean Microsystems

USA . 6,785 parts In-Stock

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Problanco Electronics

Mexico . 4,310 parts In-Stock

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SupplyDigital Components

Austria . 1,741 parts In-Stock

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TANS Electronics

Latvia . 1,682 parts In-Stock

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Corphita

USA . 1,316 parts In-Stock

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UHIMA Technologies

Türkiye . 927 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Overview

Discover the NLX1G97CMUTCG by Onsemi, a high-quality Other Function Logic IC that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With a compact design and advanced technology, this IC delivers fast propagation delay and operates efficiently at various voltages. Experience the value and benefits of this product with its easy surface mount installation and dual terminal position. Upgrade your electronic projects with the NLX1G97CMUTCG and enjoy superior performance and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 14.4 ns

Low propagation delay ensures fast signal processing and response times, making this IC efficient in time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and improving overall design flexibility.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, ensuring compatibility with many standard circuits and power sources.

Load Capacitance (CL): 30 pF

Low load capacitance minimizes signal distortion and interference, enhancing the overall performance and reliability of the IC.

Power Supplies (V): 1.8/5

Ability to operate at dual power supplies allows for versatile integration into different systems and applications.

No. of Terminals: 6

The moderate number of terminals ensures easier connectivity and compatibility with a variety of circuit layouts and designs.

Temperature Grade: MILITARY

Designed to meet rigorous military-grade standards, ensuring high reliability and performance under extreme operating conditions.

Schmitt Trigger: YES

Incorporation of a Schmitt trigger helps in achieving signal stability and noise immunity, vital for accurate signal processing in digital circuits.

Technology: CMOS

Utilizing CMOS technology offers benefits such as low power consumption, high noise immunity, and high speed operation, making this IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs NLX1G97CMUTCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G97CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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