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NLX1G97CMX1TCG

Onsemi

NLX1G97CMX1TCG by Onsemi

NLX1G97CMX1TCG by Onsemi features 14.4ns propagation delay, 30pF load capacitance, and 8A max I (ol). Ideal for military applications due to its CMOS technology and Schmitt Trigger feature. With a small outline package style and surface mount capability, it is suitable for compact electronic designs.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

42,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.100

42,000

-

-

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$0.100

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

42,000

-

-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 312 parts In-Stock

1+ parts

$0.085

100+ parts

-

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-

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312

$0.085

-

-

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Digiode

USA . 2,118 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

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-

2,118

$0.093

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 327 parts In-Stock

1+ parts

$0.085

100+ parts

-

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327

$0.085

-

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Corphita

USA . 1,423 parts In-Stock

1+ parts

$0.088

100+ parts

-

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1,423

$0.088

-

-

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Vigor

Singapore . 622 parts In-Stock

1+ parts

$0.090

100+ parts

-

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622

$0.090

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Component Stockers USA

USA . 44,876 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.080

10k+ parts

$0.080

44,876

$0.100

$0.090

$0.080

$0.080

Advanced Electronics

New Zealand . 400 parts In-Stock

1+ parts

$16.122

100+ parts

$14.671

1k+ parts

$13.220

10k+ parts

-

400

$16.122

$14.671

$13.220

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Continental Prestige Electronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.085

10k+ parts

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42,000

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-

$0.085

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TANS Electronics

Latvia . 7,275 parts In-Stock

1+ parts

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7,275

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Problanco Electronics

Mexico . 5,770 parts In-Stock

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5,770

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Perfect Parts

USA . 4,424 parts In-Stock

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4,424

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Kulean Microsystems

USA . 3,873 parts In-Stock

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3,873

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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SupplyDigital Components

Austria . 1,664 parts In-Stock

1+ parts

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1,664

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UHIMA Technologies

Türkiye . 959 parts In-Stock

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959

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Microchip USA

USA . 458 parts In-Stock

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458

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Overview

Discover the NLX1G97CMX1TCG by Onsemi, a high-quality Other Function Logic IC that offers exceptional performance and reliability. With a nominal supply voltage of 2.3V and a propagation delay of just 14.4ns, this product is perfect for a wide range of applications. From industrial to automotive, the possibilities are endless. Trust in Onsemi's reputation for excellence and innovation to deliver a product that exceeds expectations. Experience the value and benefits of the NLX1G97CMX1TCG - a game-changer in the world of logic ICs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.4 ns

Low propagation delay ensures fast and efficient performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Package Shape: SQUARE

Square package shape can optimize space on the circuit board and facilitate efficient PCB layout.

Nominal Supply Voltage / Vsup (V): 2.3

Works efficiently at a specific supply voltage, ensuring reliable performance.

Load Capacitance (CL): 30 pF

Suitable for driving capacitive loads without compromising performance.

Power Supplies (V): 1.8/5

Supports multiple power supply options, increasing flexibility in circuit design.

No. of Terminals: 6

Sufficient terminals for connections, allowing for versatile applications.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact package style saves space and allows for easy integration into a small form factor.

Maximum I (ol): 8 Amp

Capable of driving high currents, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely low temperatures, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for long-term reliability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connections.

Maximum Seated Height: 0.4 mm

Low profile design saves space and enables installation in compact devices.

Width: 1 mm

Narrow width enables compact circuit designs.

Minimum Supply Voltage (Vsup): 1.65 V

Works efficiently even at low supply voltages, increasing compatibility with various systems.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes.

Length: 1 mm

Compact length for space-saving designs.

Temperature Grade: MILITARY

Meets military-grade standards for reliability and performance in demanding applications.

Schmitt Trigger: YES

Incorporation of Schmitt trigger for noise immunity and improved signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability and compliance with regulations.

Packing Method: TR

Tape and reel packing method for easy handling and automated assembly processes.

Terminal Pitch: 0.35 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages for versatile applications.

Technical Specifications

Other Function Logic ICs NLX1G97CMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G97CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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