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NLX1G58AMX1TCG

Onsemi

NLX1G58AMX1TCG by Onsemi

NLX1G58AMX1TCG by Onsemi is a CMOS Schmitt Trigger IC with 6.3ns propagation delay, 50pF load capacitance, and 24A max I (ol). It operates b/w -55 to 125 °C and is ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 353,153 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

353,153

-

$0.092

$0.077

$0.068

DigiKey

USA . 353,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.080

353,153

-

-

-

$0.080

Verical

USA . 299,153 parts In-Stock

1+ parts

-

100+ parts

-

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$0.086

299,153

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-

$0.086

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 402 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

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402

$0.072

-

-

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Vyrian

USA . 2,464 parts In-Stock

1+ parts

$0.076

100+ parts

-

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2,464

$0.076

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,492 parts In-Stock

1+ parts

$0.068

100+ parts

-

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1,492

$0.068

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Vigor

Singapore . 182 parts In-Stock

1+ parts

$0.070

100+ parts

-

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182

$0.070

-

-

-

Corohmni

South Africa . 310 parts In-Stock

1+ parts

$0.076

100+ parts

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310

$0.076

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Continental Prestige Electronics

USA . 353,153 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.066

10k+ parts

-

353,153

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-

$0.066

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Authorized Procurement Solutions

USA . 40,000 parts In-Stock

1+ parts

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100+ parts

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40,000

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TANS Electronics

Latvia . 6,737 parts In-Stock

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SupplyDigital Components

Austria . 4,440 parts In-Stock

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4,440

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Kulean Microsystems

USA . 3,403 parts In-Stock

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3,403

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Problanco Electronics

Mexico . 2,541 parts In-Stock

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2,541

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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715

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Microchip USA

USA . 367 parts In-Stock

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367

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Overview

Experience unprecedented speed and efficiency with the NLX1G58AMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This Other Function Logic IC boasts a swift propagation delay of 6.3 ns, making it ideal for a wide range of applications. From consumer electronics to industrial machinery, this versatile component offers unparalleled performance and precision. Elevate your projects with the NLX1G58AMX1TCG and enjoy the advantage of seamless operation and enhanced functionality. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, making it convenient for mass production.

Nominal Supply Voltage / Vsup (V): 2.3

Operates at a low nominal supply voltage, leading to reduced power consumption and increased efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Schmitt Trigger: YES

Inclusion of Schmitt trigger provides hysteresis, improving noise immunity and signal stability in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making this product energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs NLX1G58AMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G58AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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