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SN74LVC1G98DCK

Texas Instruments

SN74LVC1G98DCK by Texas Instruments

SN74LVC1G98DCK by Texas Instruments is a CMOS logic IC with 6 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.65V to 5.5V and features a 3-STATE output characteristic. This small outline package is ideal for industrial applications requiring compact design and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,573 parts In-Stock

1+ parts

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3,573

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Digiode

USA . 1,599 parts In-Stock

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1,599

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 836 parts In-Stock

1+ parts

$4.000

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836

$4.000

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Parana Technologies

USA . 1,440 parts In-Stock

1+ parts

$8.582

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$9.244

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1,440

$8.582

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$9.244

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DigiPath Technology Company

USA . 1,731 parts In-Stock

1+ parts

$9.450

100+ parts

$8.694

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1,731

$9.450

$8.694

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IDEA Electronic Components Group

UK . 1,801 parts In-Stock

1+ parts

$9.643

100+ parts

$9.161

1k+ parts

$8.679

10k+ parts

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1,801

$9.643

$9.161

$8.679

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ChromeModa Solutions

Germany . 1,169 parts In-Stock

1+ parts

$9.643

100+ parts

$7.907

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1,169

$9.643

$7.907

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AZTECH Wire

Italy . 218 parts In-Stock

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$15.143

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218

$15.143

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Corphita

USA . 1,995 parts In-Stock

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1,995

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Overview

Enhance your electronic projects with the high-quality SN74LVC1G98DCK by Texas Instruments, a top-tier manufacturer known for innovative solutions. This versatile logic IC falls under the category of Other Function Logic ICs, offering a wide range of applications in various industries. With its compact design and advanced technology, this product ensures reliable performance and efficiency. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the SN74LVC1G98DCK and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and impact resistance, ensuring the IC's longevity and reliability.

Surface Mount: YES

Surface mount technology enables easier and more efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for portable devices or applications where power consumption is critical.

Output Characteristics: 3-STATE

The 3-state output allows the IC to disconnect from the output bus, providing flexibility in controlling signal flow and reducing power consumption when the output is inactive.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and a wide operating voltage range, making the IC suitable for various applications.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments or applications where heat dissipation is a concern.

Technical Specifications

Other Function Logic ICs SN74LVC1G98DCK attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

SN74LVC1G98DCK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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