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NLX1G97BMX1TCG

Onsemi

NLX1G97BMX1TCG by Onsemi

NLX1G97BMX1TCG by Onsemi is a CMOS Schmitt Trigger IC with 14.4ns propagation delay, 30pF load capacitance, and 8A max I (ol). Ideal for military applications due to its MIL-graded temperature range and small outline package style.

Median Price

$0.083

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43,800 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

43,800

-

$0.092

$0.077

$0.068

Avnet

USA . 43,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.080

10k+ parts

$0.070

43,800

-

-

$0.080

$0.070

Verical

USA . 43,800 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.086

43,800

-

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$0.086

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

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-

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$0.002

1,000

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-

$0.002

Distributors (In-Stock)

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Digiode

USA . 952 parts In-Stock

1+ parts

$0.072

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952

$0.072

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Vyrian

USA . 7,752 parts In-Stock

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7,752

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Distributors (Availability)

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$0.002

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168

$0.002

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Corphita

USA . 1,219 parts In-Stock

1+ parts

$0.068

100+ parts

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1,219

$0.068

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Vigor

Singapore . 494 parts In-Stock

1+ parts

$0.070

100+ parts

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494

$0.070

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AZTECH Wire

Italy . 695 parts In-Stock

1+ parts

$14.480

100+ parts

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695

$14.480

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Continental Prestige Electronics

USA . 43,800 parts In-Stock

1+ parts

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100+ parts

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$0.066

10k+ parts

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43,800

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$0.066

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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Kulean Microsystems

USA . 7,408 parts In-Stock

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7,408

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TANS Electronics

Latvia . 5,716 parts In-Stock

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5,716

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Problanco Electronics

Mexico . 1,592 parts In-Stock

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1,592

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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922

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SupplyDigital Components

Austria . 630 parts In-Stock

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630

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Microchip USA

USA . 311 parts In-Stock

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311

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Overview

Discover the NLX1G97BMX1TCG by Onsemi, a cutting-edge Other Function Logic IC that offers unparalleled quality and performance. With a propagation delay of just 14.4 ns and a maximum I (ol) of 8 Amp, this product is perfect for applications requiring fast response times and high current loads. Designed with precision and reliability in mind, Onsemi's reputation as a trusted manufacturer ensures that you are getting a top-tier product. Whether you're working on military-grade projects or industrial applications, the NLX1G97BMX1TCG delivers exceptional value and advantages that will exceed your expectations. Experience the difference with Onsemi today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.4 ns

Low propagation delay ensures quick response time for the logic IC, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.3

Operating at a nominal supply voltage of 2.3V, this IC offers energy efficiency and compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact footprint, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance in demanding scenarios.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC ideal for applications that require efficient power utilization and reliable signal processing.

Technical Specifications

Other Function Logic ICs NLX1G97BMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G97BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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