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SN77701N

Texas Instruments

SN77701N by Texas Instruments

SN77701N by Texas Instruments is a CMOS logic IC with 16 terminals, operating voltage of 8V, and temperature range from -35 to 65°C. It comes in an in-line package shape made of plastic/epoxy material. Ideal for applications requiring high reliability and performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,055 parts In-Stock

1+ parts

-

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5,055

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Digiode

USA . 472 parts In-Stock

1+ parts

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472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$18.172

100+ parts

-

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784

$18.172

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Parana Technologies

USA . 2,230 parts In-Stock

1+ parts

$22.171

100+ parts

$2,058.894

1k+ parts

$19.954

10k+ parts

-

2,230

$22.171

$2,058.894

$19.954

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DigiPath Technology Company

USA . 126 parts In-Stock

1+ parts

$24.413

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126

$24.413

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IDEA Electronic Components Group

UK . 1,680 parts In-Stock

1+ parts

$24.911

100+ parts

$23.665

1k+ parts

$22.420

10k+ parts

-

1,680

$24.911

$23.665

$22.420

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ChromeModa Solutions

Germany . 1,333 parts In-Stock

1+ parts

$24.911

100+ parts

$20.427

1k+ parts

-

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1,333

$24.911

$20.427

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One Stop Electronics

USA . 1,300 parts In-Stock

1+ parts

$49.000

100+ parts

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1,300

$49.000

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Corphita

USA . 3,831 parts In-Stock

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3,831

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SN77701N Other Function Logic IC. This versatile component offers a wide range of applications, providing exceptional performance in various electronic devices. Designed to meet the demanding standards of modern technology, this IC delivers superior functionality and efficiency. Trust Texas Instruments for innovative solutions that exceed expectations, and elevate your projects to new heights with the SN77701N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable or rugged applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making the product more compact and suitable for tight layouts.

Nominal Supply Voltage / Vsup (V): 8

The nominal supply voltage of 8V ensures compatibility with a wide range of systems and applications, providing flexibility in usage.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, resulting in efficient and reliable operation.

Technical Specifications

Other Function Logic ICs SN77701N attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-35 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

8

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN77701N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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