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SN54LS629FK

Texas Instruments

SN54LS629FK by Texas Instruments

SN54LS629FK by Texas Instruments is a TTL technology logic IC with 2 functions, operating at temperatures from -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a square chip carrier package style suitable for military applications. The package body material is ceramic with metal-sealed cofired construction, making it ideal for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,634 parts In-Stock

1+ parts

-

100+ parts

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2,634

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Digiode

USA . 1,866 parts In-Stock

1+ parts

-

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1k+ parts

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1,866

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$16.698

100+ parts

-

1k+ parts

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10k+ parts

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372

$16.698

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Parana Technologies

USA . 250 parts In-Stock

1+ parts

$21.583

100+ parts

-

1k+ parts

$21.975

10k+ parts

-

250

$21.583

-

$21.975

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ChromeModa Solutions

Germany . 4,308 parts In-Stock

1+ parts

$24.251

100+ parts

$19.886

1k+ parts

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10k+ parts

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4,308

$24.251

$19.886

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IDEA Electronic Components Group

UK . 683 parts In-Stock

1+ parts

$24.251

100+ parts

$23.038

1k+ parts

$21.826

10k+ parts

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683

$24.251

$23.038

$21.826

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One Stop Electronics

USA . 1,280 parts In-Stock

1+ parts

$25.000

100+ parts

-

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1,280

$25.000

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Corphita

USA . 1,848 parts In-Stock

1+ parts

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1,848

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DigiPath Technology Company

USA . 761 parts In-Stock

1+ parts

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100+ parts

$21.865

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10k+ parts

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761

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$21.865

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Overview

Enhance your electronic projects with the SN54LS629FK by Texas Instruments, a top-quality logic IC guaranteed to deliver exceptional performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this chip offers reliability and precision in various applications. Whether you're designing consumer electronics or industrial equipment, this versatile IC provides the value, benefits, and advantages you need to bring your creations to life. Upgrade your projects today with the SN54LS629FK and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and resistance to harsh environmental conditions, making the product suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving space and enhancing overall assembly efficiency.

No. of Functions: 2

With two functions in a single IC, this product offers increased functionality and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources, making integration into existing systems seamless.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in extreme conditions, ensuring the product's longevity and stability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables the product to function in cold environments without compromising its performance.

Technology: TTL

The TTL technology offers fast response times and low power consumption, making the product energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs SN54LS629FK attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SN54LS629FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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